Package substrate with a mold extension and z-height reset layer

A method, comprising:

• forming a plurality of first pillars on a first surface of a substrate;
• forming a first mold layer over the substrate, wherein the first mold layer embeds the plurality of first pillars;
• recessing the first mold layer to expose the plurality of first pillars;
• forming a plurality of second pillars on corresponding ones of the plurality of first pillars;
• attaching a component to the first mold layer;
• forming a second mold layer over the first mold layer, wherein the second mold layer embeds the plurality of second pillars and the component;
• recessing the second mold layer to expose the plurality of second pillars;
• and
• attaching a die to the second mold layer, wherein the die is coupled to the plurality of second pillars and the component.

An apparatus, comprising:

• a board;
• a package substrate coupled to the board, wherein the package substrate comprises:
• a substrate;
• a first plurality of pillars over a surface of the substrate;
• a first mold layer around the first plurality of pillars;
• a second plurality of pillars on the first plurality of pillars;
• a component on the first mold layer;
• and
• a second mold layer around the second plurality of pillars and the component;
• and
• a die coupled to the package substrate, wherein the die is coupled to at least one of the first plurality of pillars.