H10W 70/68
Shapes or dispositions thereof
H10W70/68 (Shapes or dispositions thereof) appears on 18,973 US grants and 22,574 published applications in this corpus.
Search patents in H10W- Granted patents
- 18,973
- Published applications
- 22,574
- Assignees
- 2,291
- Inventors
- 23,657
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 14 | 0 |
| 1977 | 10 | 0 |
| 1978 | 4 | 0 |
| 1979 | 7 | 0 |
| 1980 | 13 | 0 |
| 1981 | 19 | 0 |
| 1982 | 21 | 0 |
| 1983 | 19 | 0 |
| 1984 | 21 | 0 |
| 1985 | 49 | 0 |
| 1986 | 36 | 0 |
| 1987 | 56 | 0 |
| 1988 | 57 | 0 |
| 1989 | 64 | 0 |
| 1990 | 75 | 0 |
| 1991 | 91 | 0 |
| 1992 | 97 | 0 |
| 1993 | 80 | 0 |
| 1994 | 130 | 0 |
| 1995 | 125 | 0 |
| 1996 | 159 | 0 |
| 1997 | 174 | 0 |
| 1998 | 229 | 0 |
| 1999 | 212 | 0 |
| 2000 | 268 | 0 |
| 2001 | 317 | 142 |
| 2002 | 363 | 439 |
| 2003 | 339 | 385 |
| 2004 | 381 | 484 |
| 2005 | 335 | 515 |
| 2006 | 331 | 511 |
| 2007 | 377 | 528 |
| 2008 | 321 | 572 |
| 2009 | 321 | 514 |
| 2010 | 404 | 526 |
| 2011 | 436 | 539 |
| 2012 | 455 | 547 |
| 2013 | 495 | 550 |
| 2014 | 546 | 705 |
| 2015 | 620 | 801 |
| 2016 | 738 | 831 |
| 2017 | 816 | 888 |
| 2018 | 827 | 978 |
| 2019 | 950 | 1205 |
| 2020 | 1018 | 1497 |
| 2021 | 1056 | 1409 |
| 2022 | 1106 | 1594 |
| 2023 | 1159 | 1653 |
| 2024 | 1159 | 1948 |
| 2025 | 1220 | 1768 |
| 2026 | 853 | 1045 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Package structure and manufacturing method thereof6 Oct 2026US 12,757,706 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Package structures and methods of manufacturing the same6 Oct 2026US 12,757,734 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Package substrate with open air gap structures6 Oct 2026US 12,757,739 B2Intel Corporation
- Method for manufacturing wiring board, method for manufacturing semiconductor device, and resin sheet6 Oct 2026US 12,757,747 B2
- Semiconductor package and manufacturing method of semiconductor package6 Oct 2026US 12,757,758 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor packages and methods of manufacturing thereof8 Oct 2026US 2026/0314284 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Lid Structure With Openings To Alleviate Leakage Of Thermal Interface Material Of A Chip Assembly8 Oct 2026US 2026/0314397 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device8 Oct 2026US 2026/0314398 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Two-sided liquid cooling8 Oct 2026US 2026/0314413 A1Adeia Semiconductor Bonding Technologies Inc.
- Semiconductor package and method of manufacturing semiconductor package8 Oct 2026US 2026/0314417 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Semiconductor chip assemblies with fan-in leads734US 5,148,265 AIST Associates, Inc. · 1992
- Discrete polymer in fan-out packages731US 9,666,502 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2017
- Fan-out PoP structure with inconsecutive polymer layer720US 9,461,018 B1Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Semiconductor chip assemblies having interposer and flexible lead719US 5,148,266 AIST Associates, Inc. · 1992
- Method for fabricating stackable chip scale semiconductor package676US 6,235,554 B1Micron Technology, Inc. · 2001