H10W 70/681
Comprising holes not having chips therein
Official title: {comprising holes not having chips therein, e.g. for outgassing, underfilling or bond wire passage}
H10W70/681 (Comprising holes not having chips therein) appears on 1,278 US grants and 1,207 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,278
- Published applications
- 1,207
- Assignees
- 415
- Inventors
- 2,457
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 3 | 0 |
| 1989 | 0 | 0 |
| 1990 | 5 | 0 |
| 1991 | 8 | 0 |
| 1992 | 8 | 0 |
| 1993 | 4 | 0 |
| 1994 | 9 | 0 |
| 1995 | 11 | 0 |
| 1996 | 15 | 0 |
| 1997 | 19 | 0 |
| 1998 | 29 | 0 |
| 1999 | 32 | 0 |
| 2000 | 44 | 0 |
| 2001 | 45 | 21 |
| 2002 | 55 | 57 |
| 2003 | 41 | 48 |
| 2004 | 57 | 48 |
| 2005 | 25 | 44 |
| 2006 | 31 | 34 |
| 2007 | 33 | 37 |
| 2008 | 22 | 40 |
| 2009 | 27 | 46 |
| 2010 | 31 | 30 |
| 2011 | 30 | 38 |
| 2012 | 29 | 46 |
| 2013 | 40 | 51 |
| 2014 | 45 | 58 |
| 2015 | 63 | 82 |
| 2016 | 64 | 51 |
| 2017 | 55 | 52 |
| 2018 | 53 | 71 |
| 2019 | 59 | 55 |
| 2020 | 50 | 63 |
| 2021 | 36 | 60 |
| 2022 | 49 | 61 |
| 2023 | 39 | 38 |
| 2024 | 42 | 40 |
| 2025 | 42 | 25 |
| 2026 | 21 | 11 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Anchor-containing underfill structures for a chip package and methods of forming the same29 Sep 2026US 12,751,304 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Package structure and method for manufacturing the same25 Aug 2026US 12,721,198 B2Nanya Technology Corporation
- Memory bandwidth aggregation using simultaneous access of stacked semiconductor memory die18 Aug 2026US 12,712,000 B2Rambus Inc.
- Package structure11 Aug 2026US 12,708,012 B2Advanced Semiconductor Engineering, Inc.
- Bonding pad structure and method for manufacturing the same21 Jul 2026US 12,690,484 B2Nanya Technology Corporation
- Bga-type radio-frequency device1 Oct 2026US 2026/0305363 A1STMicroelectronics International N. V.
- Integrated device package with carrier17 Sep 2026US 2026/0282981 A1Skyworks Solutions, Inc.
- Glass substrate for semiconductor and method for identifying glass substrate for semiconductor3 Sep 2026US 2026/0262507 A1AGC Inc.
- Integrated circuit interposer system, method and device included embedded passive components27 Aug 2026US 2026/0256001 A1Marvell Asia Pte Ltd
- Manufacturing method for a mounting board and mounting board20 Aug 2026US 2026/0248020 A1Sony Semiconductor Solutions Corporation
Most cited
By later US patents
- Method for making semiconductor device having no die supporting surface430US 5,474,958 AMotorola, Inc. · 1995
- Semiconductor package and method for fabricating the same314US 6,395,578 B1Amkor Technology, Inc. · 2002
- Semiconductor device using a chip scale package300US 6,157,080 ASharp Kabushiki Kaisha · 2000
- Semiconductor device and method of manufacturing semiconductor device273US 7,402,901 B2Sony Corporation · 2008
- Packaging multi-chip modules without wire-bond interconnection270US 5,608,262 ALucent Technologies Inc. · 1997