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US 2026/0256001 A1Published application
Integrated circuit interposer system, method and device included embedded passive components
AssigneeMarvell Asia Pte Ltd
InventorRunzi Chang
Life of this patent
Estimating the term…
Abstract
An interposer system, method and device including an interposer including a redistribution layer having a plurality of conductive pathways and passive electrical components positioned within the redistribution layer, wherein the redistribution layer electrically couples electrical devices with the passive components and/or a substrate.
Claims29
An integrated circuit system, the system comprising:
- a substrate including a circuit;
- one or more electrical devices;
- and
- an organic interposer electrically coupled with the electrical devices via a plurality of micro-bumps and electrically coupled with the substrate via a plurality of electrical contacts, the organic interposer including a redistribution layer forming a plurality of conductive pathways and one or more passive electrical components positioned within the redistribution layer, wherein the redistribution layer electrically couples the electrical devices with the circuit.
1 more element
An organic interposer for use in a high-performance computing circuits, the organic interposer comprising:
- an organic body having a top surface including a plurality of micro-bumps and a bottom surface including a plurality of electrical contacts;
- a redistribution layer formed within the organic body and including a plurality of conductive pathways;
- and
- one or more passive electrical components positioned within the redistribution layer, wherein the redistribution layer electrically couples the micro-bumps with the electrical contacts.
1 more element
A method of fabricating an integrated circuit, the method comprising:
- coupling a first surface of a body of an organic interposer to a carrier substrate;
- depositing an initial set of redistribution layers within the body, the initial set of redistribution layers including a plurality of conductive pathways surrounding one or more reserved areas intended for one or more passive electrical components;
- removing dielectric material from the one or more areas and embedding the passive electrical components within the initial set of redistribution layers within the reserved areas;
- depositing a plurality of micro-bumps onto a second surface of the body of the organic interposer;
- and
- electrically coupling one or more electrical devices to the micro-bumps.
3 more elements
An integrated circuit system, the system comprising:
- means for supporting a circuit including a circuit;
- means for computing;
- and
- organic means for electrically coupling electrically coupled with the means for computing via a plurality of micro-bumps and electrically coupled with the means for supporting via a plurality of electrical contacts, the means for electrically coupling including a redistribution layer forming a plurality of conductive pathways and one or more passive electrical components positioned within the redistribution layer, wherein the redistribution layer electrically couples the means for computing with the circuit.
1 more element
Dependencies are inferred from the claim text.