Bonding pad structure and method for manufacturing the same
AssigneeNanya Technology Corporation
InventorWu-Der Yang
Life of this patent
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Abstract
A bonding pad structure and a method of manufacturing a bonding pad structure are provided. The bonding pad structure includes a carrier, a first conductive layer disposed over the carrier, a second conductive layer disposed on the first conductive layer and contacting the first conductive layer, and a third conductive layer disposed on the second conductive layer and contacting the second conductive layer. The bonding pad structure also includes a first passivation layer disposed on the first conductive layer and contacting at least one of the first conductive layer or the second conductive layer. An upper surface of the third conductive layer facing away from the carrier is exposed from the first passivation layer.
Claims11
A bonding pad structure, comprising:
- a carrier;
- a first conductive layer disposed over the carrier;
- a second conductive layer disposed on the first conductive layer and contacting the first conductive layer;
- a third conductive layer disposed on the second conductive layer and contacting the second conductive layer;
- and
- a first passivation layer disposed on the first conductive layer and contacting at least one of the first conductive layer and the second conductive layer,
- wherein an upper surface of the third conductive layer facing away from the carrier is exposed from the first passivation layer;
- wherein the third conductive layer is not disposed between the second conductive layer and the first passivation layer;
- wherein the first passivation layer contacts the second conductive layer and the third conductive layer;
- wherein the first conductive layer, the second conductive layer, and the third conductive layer are stacked on each other to form a ladder shaped configuration;
- and
- wherein the second conductive layer has an upper surface partially covered by the first passivation layer, partially covered by the third conductive layer, and partially exposed between the first passivation layer and the third conductive layer.
Dependencies are inferred from the claim text.