Package structure
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsChun Fu Kuo, Shang Min Chuang, Ching Hung Chuang, Hsu Feng Tseng, Jia Zhen Wang
Life of this patent
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Abstract
A package structure is disclosed. The package structure includes a first substrate, a second substrate, a gap, and a directing structure. The second substrate is disposed under the first substrate. The gap is between the first substrate and the second substrate. The gap includes a first region and a second region. The first region is configured to accommodate a filling material. The directing structure is disposed in a flow path of the filling material and configured to reduce a migration of the filling material from the first region to the second region.
Claims16
A package structure, comprising:
- a first substrate;
- a second substrate disposed under the first substrate;
- a gap between the first substrate and the second substrate, wherein the gap comprises a first region and a second region, the first region is configured to accommodate a filling material;
- and
- a directing structure disposed in a flow path of the filling material and configured to reduce a migration of the filling material from the first region to the second region,
- wherein the second substrate comprises an upper surface facing the first substrate and a trench recessed from the upper surface of the second substrate, wherein the directing structure is disposed in the trench,
- wherein the directing structure comprises a plurality of protrusions arranged in an array, and wherein the plurality of protrusions is staggered from a top view.
A package structure, comprising:
- a substrate;
- a carrier disposed under the substrate and having a first upper surface facing the substrate;
- a filling material disposed between the substrate and the first upper surface of the carrier, and
- an adhesion enhancement structure disposed on the first upper surface of the carrier and configured to reduce an extent of delamination between the filling material and the first upper surface of the carrier,
- wherein the adhesion enhancement structure comprises a plurality of protrusions having a cross-section tapering toward the substrate.
A package structure, comprising:
- a substrate comprising a first portion having a first value of flexural modulus and a second portion having a second value of flexural modulus smaller than the first value of flexural modulus;
- a carrier disposed under the substrate;
- a gap between the substrate and the carrier;
- and
- a directing structure disposed in the gap, wherein the directing structure is located between the first portion and the second portion of the substrate from a top view.
Dependencies are inferred from the claim text.