US 5,608,262 A · Packaging multi-chip modules without wire-bond interconnection

Abstract

Described is a novel packaging of MCM tiles without wire-bond interconnections and in a total thickness which is reduced relative to conventional MCM packaging. The MCM tile includes a substrate with a plurality of peripheral metallizations and at least one chip flip-chip mounted on the substrate. The PWB is provided with an aperture which is smaller than the size of the silicon substrate but larger than the outside dimensions of the mounted chips. The substrate is positioned on the PWB so that its ends overlap areas of the PWB adjacent the aperture and the chips fit into the aperture. Peripheral metallizations on the substrate are interconnected to metallizations on the PWB by either solder reflow technology or conductive adhesive technology.

Claims15

Dependent claims

A low profile multi-chip module (MCM) circuit arrangement which comprises an MCM tile and a printed wiring board (PWB), the MCM tile comprising a substrate and at least one silicon chip physically and electrically connected to the substrate,

said PWB having an aperture through the PWB and contact fingers arranged peripherally of the aperture,
the substrate of the MCM tile being larger than the aperture in the PWB, the MCM tile being positioned so that ends of the substrate overlap edges of the PWB adjacent the aperture while said at least one silicon chip is positioned within the aperture, and the substrate having peripheral metalizations which are physically and electrically interconnected to contact fingers on the PWB.

Dependencies are inferred from the claim text.

Packaging multi-chip modules without wire-bond interconnection

Life of this patent

Packaging multi-chip modules without wire-bond interconnection

Life of this patent

Abstract

Claims15