H10W 70/682
Comprising holes having chips therein
Official title: {comprising holes having chips therein}
H10W70/682 (Comprising holes having chips therein) appears on 4,733 US grants and 4,069 published applications in this corpus.
Search patents in H10W- Granted patents
- 4,733
- Published applications
- 4,069
- Assignees
- 1,083
- Inventors
- 7,616
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 9 | 0 |
| 1977 | 4 | 0 |
| 1978 | 2 | 0 |
| 1979 | 4 | 0 |
| 1980 | 4 | 0 |
| 1981 | 6 | 0 |
| 1982 | 9 | 0 |
| 1983 | 10 | 0 |
| 1984 | 9 | 0 |
| 1985 | 24 | 0 |
| 1986 | 22 | 0 |
| 1987 | 34 | 0 |
| 1988 | 26 | 0 |
| 1989 | 30 | 0 |
| 1990 | 43 | 0 |
| 1991 | 51 | 0 |
| 1992 | 50 | 0 |
| 1993 | 42 | 0 |
| 1994 | 71 | 0 |
| 1995 | 71 | 0 |
| 1996 | 88 | 0 |
| 1997 | 97 | 0 |
| 1998 | 139 | 0 |
| 1999 | 122 | 0 |
| 2000 | 156 | 0 |
| 2001 | 162 | 67 |
| 2002 | 162 | 187 |
| 2003 | 156 | 166 |
| 2004 | 173 | 199 |
| 2005 | 138 | 200 |
| 2006 | 136 | 217 |
| 2007 | 151 | 219 |
| 2008 | 128 | 232 |
| 2009 | 136 | 148 |
| 2010 | 157 | 169 |
| 2011 | 156 | 163 |
| 2012 | 140 | 141 |
| 2013 | 149 | 126 |
| 2014 | 119 | 126 |
| 2015 | 113 | 173 |
| 2016 | 144 | 183 |
| 2017 | 174 | 157 |
| 2018 | 166 | 170 |
| 2019 | 151 | 171 |
| 2020 | 165 | 204 |
| 2021 | 148 | 174 |
| 2022 | 136 | 172 |
| 2023 | 123 | 93 |
| 2024 | 110 | 89 |
| 2025 | 82 | 67 |
| 2026 | 35 | 56 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor package6 Oct 2026US 12,757,763 B2Samsung Electronics Co., Ltd.
- Semiconductor package or a printed circuit board, both modified to one or more of reduce, inverse or utilize magnetic coupling caused by the load current of a semiconductor transistor25 Aug 2026US 12,721,186 B2Infineon Technologies Austria AG
- Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assemblies25 Aug 2026US RE51,016 E1Adeia Semiconductor Technologies LLC
- Device for thermal conduction and electrical isolation18 Aug 2026US 12,713,528 B2Nitride Global Inc.
- Pre-molded lead frames for semiconductor packages18 Aug 2026US 12,713,939 B2Infineon Technologies AG
- Semiconductor device assemblies with cavity-embedded cubes and logic-supporting interposers8 Oct 2026US 2026/0314455 A1Micron Technology, Inc.
- Microelectronic assemblies8 Oct 2026US 2026/0314496 A1Intel Corporation
- Chip package and circuit device for virtual currency computation24 Sep 2026US 2026/0293701 A1Bitdeer Semiconductor Technology PTE. LTD.
- Packaging substrate and method of manufacturing the same24 Sep 2026US 2026/0293731 A1Absolics Inc.
- Method of manufacturing device-embedded board and device-embedded board17 Sep 2026US 2026/0282982 A1Fujikura Ltd.
Most cited
By later US patents
- Method for fabricating stackable chip scale semiconductor package676US 6,235,554 B1Micron Technology, Inc. · 2001
- Methods for manufacturing a semiconductor package having a sacrificial layer553US 6,001,671 ATessera, Inc. · 1999
- Single piece package for semiconductor die528US 5,739,585 AMicron Technology, Inc. · 1998
- Radio frequency identification tag having an article integrated antenna518US 6,107,920 AMotorola, Inc. · 2000
- Method for fabricating self-assembling microstructures513US 5,545,291 AThe Regents of the University of California · 1996