Packaging substrate and method of manufacturing the same
AssigneeAbsolics Inc.
InventorSungjin KIM
Life of this patent
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AssigneeAbsolics Inc.
InventorSungjin KIM
Estimating the term…
An embodiment relates to a packaging substrate and a method of manufacturing the same. The packaging substrate includes a core layer, wherein the core layer may include a glass substrate including a first surface and a second surface facing each other, and at least two or more cavity portions having different depths. The cavity portion includes a first cavity portion open and recessed in the direction toward the first surface and having a first depth and a third cavity portion having a third depth passing through the first surface and the second surface. A third cavity element is arranged in the third cavity portion, an insulating layer is disposed on the third cavity element and connection electrodes are disposed on the third cavity element in both direction toward the first surface and the second surface.
A packaging substrate comprising a core layer,
Dependencies are inferred from the claim text.