Method of manufacturing device-embedded board and device-embedded board

A method of manufacturing a device-embedded board comprising:

• temporarily fixing an electronic device to a first outer board having a through hole filled with a conductive paste;
• stacking the first outer board, a second outer board, and an inner board having a first opening such that the electronic device is inserted into the first opening and the inner board is sandwiched between the first outer board and the second outer board;
• and
• fixing the first outer board, the second outer board, and the inner board together by heating and pressing the first outer board, the second outer board, and the inner board, wherein
• the electronic device comprises:
• a device main body having a first main surface in which an electrode pad is disposed;
• a first insulating layer having a second opening and disposed on a first main surface side with respect to the device main body;
• and
• a first wiring layer disposed on the first insulating layer, covering the second opening, and electrically connected to the electrode pad, and
• the temporary fixing of the electronic device includes pressing the electronic device against the first outer board with the conductive paste contacting the first wiring layer.

A device-embedded board comprising:

• an electronic device;
• a first outer board on which the electronic device is disposed;
• an inner board having a first opening accommodating the electronic device and disposed on the first outer board;
• and
• a second outer board disposed on the inner board and covering the electronic device, wherein
• the electronic device comprises:
• a device main body having a first main surface on which an electrode pad is disposed;
• a first insulating layer having a second opening and disposed on a first main surface side with respect to the device main body;
• and
• a first wiring layer:
• disposed on the first insulating layer,
• covering the second opening,
• electrically connected to the electrode pad, and
• comprising a concave in the second opening and a convex on the first insulating layer, and
• the first outer board comprises a conductive paste via connected to the first wiring layer, the convex, and the concave.