H10W 70/6875
Being on a metallic substrate
Official title: {being on a metallic substrate, e.g. insulated metal substrates [IMS]}
H10W70/6875 (Being on a metallic substrate) appears on 665 US grants and 627 published applications in this corpus.
Search patents in H10W- Granted patents
- 665
- Published applications
- 627
- Assignees
- 316
- Inventors
- 1,532
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 2 | 0 |
| 1981 | 3 | 0 |
| 1982 | 4 | 0 |
| 1983 | 6 | 0 |
| 1984 | 3 | 0 |
| 1985 | 10 | 0 |
| 1986 | 7 | 0 |
| 1987 | 6 | 0 |
| 1988 | 7 | 0 |
| 1989 | 14 | 0 |
| 1990 | 8 | 0 |
| 1991 | 17 | 0 |
| 1992 | 15 | 0 |
| 1993 | 5 | 0 |
| 1994 | 13 | 0 |
| 1995 | 6 | 0 |
| 1996 | 18 | 0 |
| 1997 | 15 | 0 |
| 1998 | 14 | 0 |
| 1999 | 12 | 0 |
| 2000 | 9 | 0 |
| 2001 | 15 | 0 |
| 2002 | 10 | 14 |
| 2003 | 10 | 12 |
| 2004 | 10 | 16 |
| 2005 | 11 | 22 |
| 2006 | 7 | 17 |
| 2007 | 12 | 25 |
| 2008 | 11 | 21 |
| 2009 | 8 | 16 |
| 2010 | 21 | 24 |
| 2011 | 16 | 19 |
| 2012 | 16 | 31 |
| 2013 | 18 | 26 |
| 2014 | 23 | 19 |
| 2015 | 18 | 17 |
| 2016 | 18 | 31 |
| 2017 | 26 | 29 |
| 2018 | 21 | 33 |
| 2019 | 29 | 27 |
| 2020 | 19 | 33 |
| 2021 | 32 | 49 |
| 2022 | 29 | 43 |
| 2023 | 21 | 35 |
| 2024 | 30 | 36 |
| 2025 | 26 | 18 |
| 2026 | 13 | 14 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method for manufacturing and module of a semiconductor power module with heat dissipation function29 Sep 2026US 12,751,285 B2Hitachi Energy Ltd
- Device for thermal conduction and electrical isolation18 Aug 2026US 12,713,528 B2Nitride Global Inc.
- Power semiconductor device with cooler herein28 Jul 2026US 12,696,764 B2Hitachi Astemo, Ltd.
- Embedding an electronic component in a core of an integrated circuit substrate21 Jul 2026US 12,690,487 B2Microsoft Technology Licensing, LLC
- Semiconductor device and manufacturing method of the same14 Jul 2026US 12,685,225 B2Kioxia Corporation
- Semiconductor device and manufacturing method of the same1 Oct 2026US 2026/0305475 A1Kioxia Corporation
- Semiconductor structure, fabrication method and package structure thereof17 Sep 2026US 2026/0283047 A1Vanguard International Semiconductor Corporation
- Resin-clad metal foil, method for manufacturing printed wiring board, and method for manufacturing semiconductor package20 Aug 2026US 2026/0242612 A1Resonac Corporation
- Rf amplifier devices and methods of manufacturing including modularized designs with flip chip interconnections and integration into packaging6 Aug 2026US 2026/0230051 A1Wolfspeed, Inc.
- Integrated Electronic Component30 Jul 2026US 2026/0223708 A1NTT, Inc.
Most cited
By later US patents
- Thinned die integrated circuit package312US 6,841,413 B2Intel Corporation · 2005
- Ball grid array integrated circuit package with thermal conductor198US 5,583,378 AAmkor Electronics, Inc. · 1996
- Microelectronic package having a bumpless laminated interconnection layer189US 6,555,906 B2Intel Corporation · 2003
- IC chip mounting method152US 5,048,179 ARicoh Company, Ltd. · 1991
- Thin cavity down ball grid array package based on wirebond technology136US 5,420,460 AVLSI Technology, Inc. · 1995