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US 2026/0223708 A1Published application
Integrated Electronic Component
AssigneeNTT, Inc.
InventorTadashi Minotani
Life of this patent
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Abstract
An integrated electronic component includes a lower chip having electrode pads, a molded resin, a rewiring layer, and an upper chip having electrode pads. The rewiring layer has electrode pads that are formed on the lower surface of an insulator and are connected to the electrode pads, electrode pads that are formed on the upper surface of the insulator and are connected to the electrode pads, and interlayer connection conductors that are formed in the insulator and connect the electrode pads and the electrode pads. The electrode pads and the electrode pads are disposed to face each other.
Claims5
An integrated electronic component comprising:
- electrical conductors;
- and
- a plurality of chips;
- wherein each of the chips is arranged to face at least one other chip.
1 more element
Dependencies are inferred from the claim text.