IC chip mounting method

A method for mounting an IC chip, comprising the steps of:

• (a) adhesively attaching a polyimide film to a substrate formed with at least one hole using a polyimide family adhesive agent, said substrate having a first surface;
• (b) inserting an IC chip, which has at least one contact pad at a second surface thereof, into said hole such that said second surface of said IC chip is brought into adhesive contact with said polyimide family adhesive agent;
• (c) filling a gap between said hole and said IC chip with a filler material;
• (d) forming a contact hole extending through said polyimide film and said polyimide family adhesive agent;
• and
• (e) forming an interconnect which extends through said contact hole to be in electrical connection with said contact pad of said IC chip.

An IC chip mounting method, comprising the steps of:

• (a) adhesively attaching a resin film to a substrate formed with at least one hole using an adhesive agent, said substrate having a first surface;
• (b) inserting an IC chip, which has at least one contact pad on its second surface, into said hole such that said second surface of said IC chip is brought into adhesive contact with said adhesive agent;
• (c) filling a gap between said hole and said IC chip with a filler material;
• (d) removing said resin film and said adhesive agent from said substrate;
• (e) forming a polyimide film covering said first and second surfaces;
• (f) forming at least one contact hole through said polyimide film in registry in position with said contact pad of said IC chip;
• and
• (g) forming an interconnect extending through said contact hole to be in electrical contact with said contact pad of said IC chip.

An IC chip mounting method, comprising the steps of:

• (a) forming at least one first film on a first flat surface of a substrate;
• (b) providing at least one IC chip on said first film as being aligned in position with a first surface, on which at least one contact pad is provided, of said IC chip facing said first film;
• (c) forming a first electrically insulating film on said first film covering a second surface of said IC chip provided on said first film;
• (d) forming at least one contact hole in said first insulating film;
• (e) forming a first metal interconnect on said first insulating film;
• (f) forming a second electrically insulating film on said first metal interconnect;
• (g) adhesively attaching a support plate to said second insulating film;
• (h) applying a predetermined processing to said first film to have said first film separated away from said substrate;
• (i) removing said first film from said IC chip;
• (j) forming a third electrically insulating film on said IC chip;
• (k) forming at least one contact hole in said third insulting film;
• and
• (l) forming a second metal interconnect on said third insulating film.