Microelectronic package having a bumpless laminated interconnection layer
AssigneeIntel Corporation
InventorsSteven Towle, Paul H. Wermer
Life of this patent
Estimating the term…
Abstract
A microelectronic device fabrication technology that places at least one microelectronic die within at least one opening in a microelectronic package core and secures the microelectronic die/dice within the opening(s) with an encapsulation material, that encapsulates at least one microelectronic die within an encapsulation material without a microelectronic package core, or that secures at least one microelectronic die within at least one opening in a heat spreader. A laminated interconnector of dielectric materials and conductive traces is then attached to the microelectronic die/dice and at least one of following: the encapsulation material, the microelectronic package core, and the heat spreader, to form a microelectronic device.
Claims14
A microelectronic package, comprising:
- a microelectronic die having an active surface and at least one side;
- encapsulation material adjacent said at least one microelectronic die side, wherein said encapsulation material includes at least one surface substantially planar to said microelectronic die active surface;
- and
- a laminated interconnector disposed adjacent to said microelectronic die active surface and said encapsulation material surface, said laminated interconnector electrically contacting said microelectronic die active surface.
A microelectronic package, comprising:
- a microelectronic package core having a first surface and an opposing second surface, said microelectronic package core having at least one opening defined therein extending from said microelectronic package core first surface to said microelectronic package core second surface;
- at least one microelectronic die disposed within said at least one opening, said at least one microelectronic die having an active surface;
- an encapsulation material adhering said microelectronic package core to said at least one microelectronic die;
- and
- a laminated interconnector disposed adjacent to said microelectronic die active surface and said microelectronic package core, said laminated interconnector electrically contacting said microelectronic die active surface.
A microelectronic package, comprising:
- a heat spreader having a first surface, said heat spreader having at least one recess defined therein by at least one sidewall extending from said heat spreader first surface to a recess bottom surface;
- at least one microelectronic die disposed within said at least one recess, said at least one microelectronic die having an active surface, a back surface, and at least one side;
- a thermally conductive material adhering said at least one microelectronic die back surface to said recess bottom surface;
- and
- a laminated interconnector disposed adjacent to said microelectronic die active surface and said heat spreader, said laminated interconnector electrically contacting said microelectronic die active surface.
Dependencies are inferred from the claim text.