Power semiconductor device with cooler herein

A power semiconductor device comprising:

• a circuit body in which a conductor plate and a semiconductor element mounted on the conductor plate are sealed with a sealing resin;
• a cooler disposed opposite to at least one surface of the circuit body;
• and
• an insulating member disposed between the circuit body and the cooler,
• the insulating member including:
• an insulating sheet bonded to the cooler;
• a conductor layer bonded to a surface of the insulating sheet, the surface facing the circuit body, wherein the conductor layer is embedded in and bonded to the insulating sheet;
• and
• electrically insulating heat dissipation grease filled between the circuit body and the cooler, and formed covering the insulating sheet and the conductor layer.

A power semiconductor device comprising:

• a circuit body in which a conductor plate and a semiconductor element mounted on the conductor plate are sealed with a sealing resin;
• a cooler disposed opposite to at least one surface of the circuit body;
• and
• an insulating member disposed between the circuit body and the cooler,
• the insulating member including:
• an insulating sheet bonded to the cooler;
• a conductor layer bonded to a surface of the insulating sheet, the surface facing the circuit body, wherein the conductor layer has an end part covered with an insulating resin having lower elasticity than the sealing resin of the circuit body;
• and
• electrically insulating heat dissipation grease filled between the circuit body and the cooler, and formed covering the insulating sheet and the conductor layer.