Embedding an electronic component in a core of an integrated circuit substrate

An electronic device, comprising:

• a substrate comprising a core and one or more buildup layers coupled with the core, each buildup layer comprising a metal layer and a dielectric layer, the core comprising
• a center comprising a plurality of plies, and
• an additional layer coupled to the center, the additional layer comprising one or more additional plies;
• an electronic component embedded in the center and aligned with a capture pad of the center of the core, the capture pad being located between plated through hole vias in the center of the core, the electronic component comprising an integrated passive device and a thickness less than a thickness of the core;
• and
• an integrated circuit die coupled with the substrate and electrically connected to the electronic component.

An electronic device, comprising:

• a substrate comprising a core and one or more buildup layers coupled with the core, each buildup layer comprising a metal layer and a dielectric layer, the core comprising
• a center comprising a plurality of plies, plated through hole vias, and a capture pad located between the plated through hole vias, and
• an additional layer coupled to the center, the additional layer comprising one or more additional plies;
• an electronic component embedded in the additional layer and aligned with the capture pad of the center of the core, the electronic component comprising a thickness less than a thickness of the core;
• and
• an integrated circuit die coupled with the substrate and electrically connected to the electronic component.