H10W 70/685
Comprising multiple insulating layers
Official title: comprising multiple insulating layers
H10W70/685 (Comprising multiple insulating layers) appears on 12,182 US grants and 15,564 published applications in this corpus.
Search patents in H10W- Granted patents
- 12,182
- Published applications
- 15,564
- Assignees
- 1,411
- Inventors
- 15,683
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 8 | 0 |
| 1977 | 6 | 0 |
| 1978 | 1 | 0 |
| 1979 | 4 | 0 |
| 1980 | 7 | 0 |
| 1981 | 11 | 0 |
| 1982 | 11 | 0 |
| 1983 | 9 | 0 |
| 1984 | 9 | 0 |
| 1985 | 18 | 0 |
| 1986 | 15 | 0 |
| 1987 | 32 | 0 |
| 1988 | 29 | 0 |
| 1989 | 32 | 0 |
| 1990 | 33 | 0 |
| 1991 | 38 | 0 |
| 1992 | 39 | 0 |
| 1993 | 38 | 0 |
| 1994 | 65 | 0 |
| 1995 | 64 | 0 |
| 1996 | 68 | 0 |
| 1997 | 99 | 0 |
| 1998 | 115 | 0 |
| 1999 | 104 | 0 |
| 2000 | 122 | 0 |
| 2001 | 146 | 60 |
| 2002 | 164 | 207 |
| 2003 | 147 | 169 |
| 2004 | 174 | 242 |
| 2005 | 152 | 234 |
| 2006 | 157 | 248 |
| 2007 | 180 | 260 |
| 2008 | 162 | 272 |
| 2009 | 160 | 278 |
| 2010 | 209 | 298 |
| 2011 | 231 | 274 |
| 2012 | 250 | 289 |
| 2013 | 259 | 293 |
| 2014 | 318 | 424 |
| 2015 | 353 | 463 |
| 2016 | 442 | 524 |
| 2017 | 518 | 599 |
| 2018 | 553 | 659 |
| 2019 | 669 | 900 |
| 2020 | 732 | 1119 |
| 2021 | 787 | 1051 |
| 2022 | 826 | 1254 |
| 2023 | 943 | 1397 |
| 2024 | 926 | 1658 |
| 2025 | 1013 | 1516 |
| 2026 | 734 | 876 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Package structure and manufacturing method thereof6 Oct 2026US 12,757,706 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Package structures and methods of manufacturing the same6 Oct 2026US 12,757,734 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Package substrate with open air gap structures6 Oct 2026US 12,757,739 B2Intel Corporation
- Method for manufacturing wiring board, method for manufacturing semiconductor device, and resin sheet6 Oct 2026US 12,757,747 B2
- Semiconductor package and manufacturing method of semiconductor package6 Oct 2026US 12,757,758 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Lid Structure With Openings To Alleviate Leakage Of Thermal Interface Material Of A Chip Assembly8 Oct 2026US 2026/0314397 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device8 Oct 2026US 2026/0314398 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor package and method of manufacturing semiconductor package8 Oct 2026US 2026/0314417 A1Samsung Electronics Co., Ltd.
- Semiconductor package including shielding layer and barrier pattern8 Oct 2026US 2026/0314425 A1Samsung Electronics Co., Ltd.
- Integrated circuit packages and methods of forming the same8 Oct 2026US 2026/0314429 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Discrete polymer in fan-out packages731US 9,666,502 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2017
- Fan-out PoP structure with inconsecutive polymer layer720US 9,461,018 B1Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Packaged semiconductor devices, methods of packaging semiconductor devices, and PoP devices620US 8,877,554 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2014
- Fan-out package structure and methods for forming the same595US 8,803,306 B1Taiwan Semiconductor Manufacturing Company.Ltd · 2014
- Packages with passive devices and methods of forming the same592US 8,680,647 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2014