H10W 70/686
The multiple insulating layers having different compositions
Official title: {the multiple insulating layers having different compositions, e.g. polymer layer on glass substrate}
H10W70/686 (The multiple insulating layers having different compositions) appears on 79 US grants and 131 published applications in this corpus.
Search patents in H10W- Granted patents
- 79
- Published applications
- 131
- Assignees
- 51
- Inventors
- 315
- Latest grant
- 4 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 2 |
| 2005 | 1 | 1 |
| 2006 | 1 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 1 | 0 |
| 2011 | 0 | 3 |
| 2012 | 0 | 0 |
| 2013 | 5 | 4 |
| 2014 | 3 | 5 |
| 2015 | 3 | 5 |
| 2016 | 6 | 4 |
| 2017 | 7 | 6 |
| 2018 | 6 | 10 |
| 2019 | 8 | 4 |
| 2020 | 4 | 8 |
| 2021 | 7 | 6 |
| 2022 | 4 | 9 |
| 2023 | 2 | 11 |
| 2024 | 7 | 9 |
| 2025 | 5 | 14 |
| 2026 | 4 | 30 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Wiring substrate4 Aug 2026US 12,702,023 B2Ibiden Co., Ltd.
- Integrated circuit structure and manufacturing method thereof28 Jul 2026US 12,696,794 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Inorganic redistribution layer on organic substrate in integrated circuit packages17 Feb 2026US 12,557,675 B2Intel Corporation
- Package structure and manufacturing method thereof13 Jan 2026US 12,525,542 B2Unimicron Technology Corp.
- Embedded organic interposer for high bandwidth16 Dec 2025US 12,500,209 B2Adeia Semiconductor Technologies LLC
- Integrated circuit structure and manufacturing method thereof8 Oct 2026US 2026/0314480 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor package1 Oct 2026US 2026/0305402 A1Mediatek Inc.
- Wiring device, manufacturing method for wiring device, and redistribution layer1 Oct 2026US 2026/0305426 A1Dai Nippon Printing Co.Ltd.
- Board apparatus, electronic apparatus, electronic device, method for manufacturing electronic apparatus, and method for manufacturing electronic device10 Sep 2026US 2026/0271761 A1Sony Semiconductor Solutions Corporation
- Deep trench capacitor (dtc) interconnect structure for embedded power supply (eps)27 Aug 2026US 2026/0255955 A1QUALCOMM Incorporated
Most cited
By later US patents
- High density chip carrier with integrated passive devices321US 7,030,481 B2Internation Business Machines Corporation · 2006
- High density chip carrier with integrated passive devices303US 6,962,872 B2International Business Machines Corporation · 2005
- Semiconductor chip carrier, module having same chip carrier mounted therein, and electronic device incorporating same module162US 5,281,151 AHitachi, Ltd. · 1994
- Capacitive chip carrier and multilayer ceramic capacitors124US 4,349,862 AInternational Business Machines Corporation · 1982
- Process for manufacturing a ceramic multi-layer substrate57US 4,736,521 ANEC Corporation · 1988