Semiconductor package
AssigneeMediatek Inc.
InventorsSang-Mao CHIU, Ching-Ku LIAO, Yi-Ting KUO, Wei-Chen CHANG
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Abstract
A semiconductor package is provided. The semiconductor package includes a substrate and a die. The die is mounted on the substrate. The substrate includes a first core layer, a second core layer, and a first pair of Prepreg (PP) layers. The second core layer is stacked on the first core layer. The first pair of Prepreg (PP) layers is disposed between the first core layer and the second core layer.
Claims19
A semiconductor package comprising:
- a substrate;
- and
- a die mounted on the substrate, wherein the substrate comprises:
- a first core layer;
- a second core layer stacked on the first core layer;
- and
- a first pair of Prepreg (PP) layers disposed between the first core layer and the second core layer.
The semiconductor structure as claimed in claim 11, wherein the first via has a first diameter, and the second via has a second diameter different from the first diameter.
A semiconductor package, comprising:
- a substrate, wherein the substrate comprises:
- a core structure, wherein the core structure comprises:
- at least two cores and at least three pairs of Prepreg (PP) layers stacked on each other, wherein the at least two cores are arranged in such a way that they alternate with the at least three pairs of PP layers,
- wherein the core structure has a first plating through hole (PTH) passing through the at least two cores and one of the three pairs of PP layers, and a second plating through hole (PTH) passing through the at least two cores and the three pairs of PP layers;
- and
- a die mounted on the substrate and coupled to the first PTH and the second PTH.
A semiconductor package, comprising:
- a substrate, wherein the substrate comprises:
- N core layers stacked on each other, wherein N is an integer greater than or equal to 2;
- 2N+2 Prepreg (PP) layers disposed on the N core layers, wherein a top surface and a bottom surface of each of the N core layers are directly covered by the 2 PP layers only;
- a first plating through hole (PTH) passing through the 2N−2 PP layers;
- and
- a second plating through hole (PTH) passing through the 2N+2 PP layers;
- and
- a die mounted on the substrate and coupled to the first PTH and the second PTH.
Dependencies are inferred from the claim text.