Process for manufacturing a ceramic multi-layer substrate
AssigneeNEC Corporation
InventorAkihiro Dohya
Life of this patent
Estimating the term…
Abstract
A multi-layer comprising a multi-layer glass ceramic substrate and a multi-layer wire line matrix. The multi-layer wired line matrix includes an insulating layer made from a photosensitive insulating layer, amenable to time geometry processing. The insulating layer of the multi-layer wire line matrix has a pad for accommodating variations of the locations of the through holes. The metal is plated in and fills the through holes so that the metal is not cut off at the corners. The wire line matrix is composed of a plurality of layers of a photo-lithographically formed fine conductive pattern. The glass ceramic insulating layer is also formed photo-lithographically, and is formed of the source material of the insulating layers.
Claims8
The method for manufacturing a module, comprising the steps of:
- forming a ceramic multi-layer substrate by sintering a plurality of laminated green sheet substrates and an included interior power wire line layer, at least one through hole piercing each of said laminated substrates, said formed ceramic substrate having a wire line filling said through hole;
- forming a conductive layer on said ceramic substrate to cover a portion of said wire line passing through said through hole and exposed at a surface of the ceramic substrate;
- and
- forming an insulating layer on said ceramic substrate to cover a selected portion of the conductive layer and a selected portion of the surface of the ceramic substrate.
A method of manufacturing a module, comprising the steps of:
- forming a ceramic multi-layer substrate;
- and
- forming on top of said substrate a multi-layer wire line matrix, each layer of said multi-layer matrix having an under conductive layer, and an insulating layer formed on the under conductive layer, a forming of said each layer comprising the steps of:
- forming a via hole in a portion of said insulating layer corresponding to a desired portion of the under conductive layer;
- filling said via hole with metal by plating for electrically connecting to the under conductive layers;
- and
- forming an upper metal on the insulating layer for electrically connecting to the metal filling said via hole.
A method of manufacturing a module, comprising the steps of:
- forming a multi-layer wired line layer matrix by alternatively laminating a desired number of conductive layers and a desired number of insulating layers on a substrate;
- detecting if a wire line is defective by inspecting a formed layer of said multi-layer wired line matrix;
- forming a fixing signal wire line layer, if said detecting step has detected said defective wire line, for providing the same function as the function provided by a non-defective wire line;
- and
- wherein said step of laminating alternatively said desired number of conductive layers and said desired number of insulating layers includes laminating upper ones of said conductive and insulating layers on the fixing signal wire line layer if said detecting step has detected said defective wire line.
Dependencies are inferred from the claim text.