US 12,500,209 B2 · Embedded organic interposer for high bandwidth

Abstract

Embedded organic interposers for high bandwidth are provided. Example embedded organic interposers provide thick conductors with more dielectric space, and more routing layers of such conductors than conventional interposers, in order to provide high bandwidth transmission capacity over longer spans. The embedded organic interposers provide high bandwidth transmission paths between components such as HBM, HBM2, and HBM3 memory stacks, and other components. To provide the thick conductors and more routing layers for greater transmission capacity, extra space is achieved by embedding the organic interposers in the core of the package. Example embedded organic interposers lower a resistive-capacitive (RC) load of the routing layers to provide an improved data transfer rate of 1 gigabits per second over at least a 6 mm span, for example. The embedded interposers are not limited to use with memory modules.

Claims18

Dependent claims

A microelectronic apparatus, comprising:

a substrate comprising at least one core layer, the at least one core layer comprising an inorganic material;
an interposer for electrically connecting microelectronic components, the interposer comprising:
a plurality of parallel organic dielectric layers;
and
a plurality of routing layers, each of the routing layers disposed between adjacent ones of the organic dielectric layers, each of the routing layers comprising horizontal traces, wherein:
the interposer is embedded in the at least one core layer, the at least one core layer and the interposer defining a horizontal substrate surface that is parallel to the horizontal traces;
and
each horizontal trace comprises a conductor having a cross-section for providing a data transfer rate of at least 1 gigabit per second between a first microelectronic component and a second microelectronic component;
and
a build-up layer disposed vertically adjacent to the horizontal substrate surface, wherein the build-up layer comprises conductors for connecting the microelectronic components to the horizontal traces.

7 more elements

Dependencies are inferred from the claim text.

Embedded organic interposer for high bandwidth

Life of this patent

Embedded organic interposer for high bandwidth

Life of this patent

Abstract

Claims18