Package structure and manufacturing method thereof
AssigneeUnimicron Technology Corp.
InventorsYing-Chu Chen, Jeng-Ting Li, Chi-Hai Kuo, Cheng-Ta Ko, Pu-Ju Lin
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Abstract
A manufacturing method of a package structure includes: forming a redistribution layer on a top surface of a glass substrate; forming a protective layer on the top surface of the glass substrate; cutting the glass substrate and the protective layer such that the glass substrate has a cutting edge, in which a crack is formed in the cutting edge of the glass substrate; and heating the protective layer such that a portion of the protective layer flows towards a bottom surface of the glass substrate to cover the cutting edge of the glass substrate and fill the crack in the cutting edge of the glass substrate.
Claims7
A package structure, comprising:
- a glass substrate having a top surface and a cutting edge adjacent to the top surface, wherein a crack is formed in the cutting edge of the glass substrate;
- a redistribution layer located on the top surface of the glass substrate;
- a protective layer located on the top surface of the glass substrate, wherein a portion of the protective layer covers the cutting edge of the glass substrate and fills the crack in the cutting edge of the glass substrate;
- and
- an electronic device located on the redistribution layer, wherein the protective layer extends on the redistribution layer to cover the electronic device.
A package structure, comprising:
- a glass substrate having a top surface and a cutting edge adjacent to the top surface, wherein a crack is formed in the cutting edge of the glass substrate;
- a redistribution layer located on the top surface of the glass substrate;
- and
- a protective layer located on the top surface of the glass substrate, wherein a portion of the protective layer covers the cutting edge of the glass substrate and fills the crack in the cutting edge of the glass substrate, wherein the protective layer is transparent.
Dependencies are inferred from the claim text.