Substrate structure, module, method for manufacturing the substrate structure, and method for manufacturing the module

A substrate structure comprising:

• a substrate having a first surface;
• a first electrode disposed on the first surface;
• a bump connected to the first electrode;
• and
• a protective member covering the first surface and covering a portion of the bump;
• wherein
• the protective member has an opening, and the bump includes a portion exposed through the opening,
• the bump includes a first portion covering connected to the first electrode, and a second portion being farther from the first electrode than the first portion and connected to the first portion,
• the bump has a constriction at a boundary between the first portion and the second portion,
• a diameter of an upper end of the opening is equal to or smaller than a maximum diameter of the first portion, and
• the protective member covers a portion of the second portion.

A module comprising:

• a substrate structure comprising:
• a first surface;
• a first electrode disposed on the first surface;
• a bump connected to the first electrode;
• and
• a protective member covering the first surface and covering a portion of the bump;
• wherein
• the protective member has an opening, and the bump includes a portion exposed through the opening,
• the bump includes a first portion connected to the first electrode, and a second portion being farther from the first electrode than the first portion and connected to the first portion,
• the bump has a constriction at a boundary between the first portion and the second portion, and
• when viewed in a direction perpendicular to the first surface, a maximum diameter of the second portion is smaller than a maximum diameter of the first portion;
• and
• a first component mounted on the first surface, the first component being at least partially covered with the protective member,
• wherein in a direction perpendicular to the first surface, a height of the first component with reference to the first surface, a height of the bump with reference to the first surface, and a height of the protective member with reference to the first surface are equal.