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US 7,932,170 B1Granted
Flip chip bump structure and fabrication method
AssigneeAmkor Technology, Inc.
InventorsRonald Patrick Huemoeller, Roger D. St. Amand, Robert Francis Darveaux
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Abstract
A method includes forming a patterned buildup layer on a first surface of a dielectric layer, the patterned buildup layer including a patterned buildup layer opening exposing a trace coupled to the dielectric layer. A conductor layer is flash plated on the patterned buildup layer and within the patterned buildup layer opening. The patterned buildup layer opening is filled with a blanket conductive filler layer. The blanket conductive filler layer and the conductor layer are planarized to form a flip chip bump.
Claims16
A method comprising:
- forming a patterned buildup layer on a first surface of a dielectric layer, the patterned buildup layer comprising a patterned buildup layer opening exposing a trace coupled to the dielectric layer, wherein an upper circuit pattern comprises the trace and wherein a lower circuit pattern is coupled to a second surface of the dielectric layer, the lower circuit pattern comprising a land;
- plating a conductor layer on the patterned buildup layer and within the patterned buildup layer opening;
- filling the patterned buildup layer opening with a blanket conductive filler layer;
- planarizing the blanket conductive filler layer and the conductor layer to form a flip chip bump;
- and
- forming an interconnection ball directly on the land.
3 more elements
A method comprising:
- forming a patterned buildup layer on a first surface of a dielectric layer, the patterned buildup layer comprising a patterned buildup layer opening exposing a trace coupled to the dielectric layer;
- plating a conductor layer on the patterned buildup layer and within the patterned buildup layer opening;
- forming a patterned upper resist on the conductor layer, the patterned upper resist comprising a flip chip bump opening above the trace;
- plating a conductive layer using the conductor layer as an electrode, the conductive layer filling the flip chip bump opening;
- stripping the patterned upper resist;
- and
- planarizing the conductive layer and the conductor layer to form a flip chip bump.
4 more elements
Dependencies are inferred from the claim text.