Semiconductor package
AssigneeLG Innotek Co., Ltd.
InventorsDae Hyeon SEONG, Su Jin PARK, Dong Hyuk KOH
Life of this patent
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Abstract
A semiconductor package according to an embodiment includes an insulating layer; a protective layer disposed on the insulating layer; a through electrode passing through the insulating layer; and a bump part disposed on the through electrode and passing through the protective layer, wherein the bump part includes a first portion connected to the through electrode; and a second portion disposed on the first portion and protruding onto the protective layer, and a width of the first portion in a horizontal direction is same as a width of the second portion in the horizontal direction.
Claims19
A circuit board package comprising:
- an insulating layer;
- and
- a circuit layer disposed on the insulating layer;
- wherein the circuit layer includes:
- a first metal layer disposed on the insulating layer;
- a second metal layer disposed on the first metal layer;
- and
- a third metal layer disposed on the second metal layer,
- wherein a width of the circuit layer in a horizontal direction in the first metal layer, a width of the circuit layer in the horizontal direction in the second metal layer, and a width of the circuit layer in the horizontal direction in the third metal layer are different from each other.
3-10. (canceled)
Dependencies are inferred from the claim text.