H10W 42/261
Characterised by their shapes or dispositions
Official title: {characterised by their shapes or dispositions}
H10W42/261 (Characterised by their shapes or dispositions) appears on 2,278 US grants and 2,797 published applications in this corpus.
Search patents in H10W- Granted patents
- 2,278
- Published applications
- 2,797
- Assignees
- 486
- Inventors
- 3,982
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1994 | 5 | 0 |
| 1995 | 4 | 0 |
| 1996 | 1 | 0 |
| 1997 | 9 | 0 |
| 1998 | 8 | 0 |
| 1999 | 6 | 0 |
| 2000 | 10 | 0 |
| 2001 | 11 | 5 |
| 2002 | 17 | 20 |
| 2003 | 27 | 27 |
| 2004 | 19 | 31 |
| 2005 | 13 | 27 |
| 2006 | 27 | 38 |
| 2007 | 20 | 40 |
| 2008 | 12 | 41 |
| 2009 | 32 | 60 |
| 2010 | 35 | 62 |
| 2011 | 72 | 85 |
| 2012 | 55 | 96 |
| 2013 | 58 | 73 |
| 2014 | 78 | 96 |
| 2015 | 95 | 148 |
| 2016 | 127 | 122 |
| 2017 | 139 | 179 |
| 2018 | 140 | 198 |
| 2019 | 179 | 187 |
| 2020 | 176 | 230 |
| 2021 | 169 | 183 |
| 2022 | 151 | 213 |
| 2023 | 153 | 274 |
| 2024 | 173 | 171 |
| 2025 | 180 | 92 |
| 2026 | 77 | 99 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H10W 42/276The arrangements being on an external surface of the package1,683
- H10W 42/273The arrangements being between laterally adjacent chips397
- H10W 42/271The arrangements being between stacked chips332
- H10W 42/267Patterned shielding planes202
- H10W 42/263Shielding bumps113
- H10W 42/265Shielding wires69
Recent patents
- Methods related to dual-sided radio-frequency package with overmold structure25 Aug 2026US 12,721,179 B2Skyworks Solutions, Inc.
- Microelectronic device package including inductor and semiconductor device25 Aug 2026US 12,721,182 B2Texas Instruments Incorporated
- Electronic devices and methods of manufacturing electronic devices25 Aug 2026US 12,721,239 B2Amkor Technology Singapore Holding Pte.Ltd.
- Device, method, and system to protect through-dielectric vias of a composite chiplet18 Aug 2026US 12,713,924 B2Intel Corporation
- Fan-out packaging structure and manufacturing method thereof18 Aug 2026US 12,713,929 B2Jcet Group Co., Ltd.
- Neutron radiation shielding material, shielding material for semiconductor device, package for semiconductor device, shielding material for nuclear reactor, nuclear reactor containment vessel, nuclear reactor building, shielding material for nuclear fusion reactor, nuclear fusion reactor, and nuclear fusion reactor building8 Oct 2026US 2026/0311898 A1Dexerials Corporation
- Electronic devices and methods of manufacturing electronic devices24 Sep 2026US 2026/0293689 A1Amkor Technology Singapore Holding Pte.Ltd.
- Photodetector17 Sep 2026US 2026/0282587 A1Sony Semiconductor Solutions Corporation
- Electromagnetic compartmental shielding for multichip cavity system-in-package (sip) module17 Sep 2026US 2026/0282931 A1Qorvo US, Inc.
- Semiconductor package and a method for forming the same17 Sep 2026US 2026/0282932 A1JCET STATS ChipPAC Korea Limited
Most cited
By later US patents
- Shielded electronic component assembly and method for making the same392US 5,639,989 AMotorola, Inc. · 1997
- Semiconductor package including a top-surface metal layer for implementing circuit features334US 7,633,765 B1Amkor Technology, Inc. · 2009
- Encapsulation package and method of packaging an electronic circuit module314US 6,534,711 B1The Goodyear Tire & Rubber Company · 2003
- Multi-chip module structure having conductive blocks to provide electrical connection between conductors on first and second sides of a conductive base substrate296US 6,495,914 B1Hitachi, Ltd. · 2002
- Semiconductor device package integrated with coil for wireless charging and electromagnetic interference shielding, and method of manufacturing the same291US 9,461,001 B1Advanced Semiconductor Engineering, Inc. · 2016