H10W 42/276
The arrangements being on an external surface of the package
Official title: {the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation}
H10W42/276 (The arrangements being on an external surface of the package) appears on 1,683 US grants and 2,076 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,683
- Published applications
- 2,076
- Assignees
- 354
- Inventors
- 2,884
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1994 | 4 | 0 |
| 1995 | 4 | 0 |
| 1996 | 1 | 0 |
| 1997 | 8 | 0 |
| 1998 | 6 | 0 |
| 1999 | 5 | 0 |
| 2000 | 6 | 0 |
| 2001 | 4 | 4 |
| 2002 | 13 | 16 |
| 2003 | 21 | 21 |
| 2004 | 15 | 22 |
| 2005 | 9 | 17 |
| 2006 | 14 | 22 |
| 2007 | 15 | 23 |
| 2008 | 6 | 31 |
| 2009 | 21 | 49 |
| 2010 | 29 | 50 |
| 2011 | 50 | 68 |
| 2012 | 46 | 76 |
| 2013 | 46 | 57 |
| 2014 | 58 | 74 |
| 2015 | 73 | 114 |
| 2016 | 90 | 95 |
| 2017 | 111 | 150 |
| 2018 | 109 | 164 |
| 2019 | 135 | 142 |
| 2020 | 133 | 165 |
| 2021 | 125 | 135 |
| 2022 | 114 | 151 |
| 2023 | 109 | 192 |
| 2024 | 115 | 124 |
| 2025 | 140 | 55 |
| 2026 | 48 | 59 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Semiconductor package and a method for forming the same17 Sep 2026US 2026/0282932 A1JCET STATS ChipPAC Korea Limited
- Semiconductor package and electronic system including the same17 Sep 2026US 2026/0282984 A1Samsung Electronics Co., Ltd.
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Most cited
By later US patents
- Shielded electronic component assembly and method for making the same392US 5,639,989 AMotorola, Inc. · 1997
- Semiconductor package including a top-surface metal layer for implementing circuit features334US 7,633,765 B1Amkor Technology, Inc. · 2009
- Multi-chip module structure having conductive blocks to provide electrical connection between conductors on first and second sides of a conductive base substrate296US 6,495,914 B1Hitachi, Ltd. · 2002
- Semiconductor device package integrated with coil for wireless charging and electromagnetic interference shielding, and method of manufacturing the same291US 9,461,001 B1Advanced Semiconductor Engineering, Inc. · 2016
- Method of forming a semiconductor package and structure thereof283US 7,030,469 B2Freescale Semiconductor, Inc. · 2006