Electronic devices and methods of manufacturing electronic devices

An electronic device, comprising:

• a substrate having a substrate top side, a substrate bottom side opposite to the substrate top side, a substrate lateral side;
• and a substrate conductive structure comprising:
• a first power terminal at the substrate top side;
• and
• a ground terminal at the substrate top side;
• a first electronic component coupled to the substrate top side;
• a first encapsulant covering the first electronic component and the substrate top side and comprising a first aperture and a second aperture, wherein:
• the first aperture comprises a first aperture sidewall;
• the second aperture comprises a second aperture sidewall;
• the first encapsulant comprises a top side;
• the first power terminal is exposed by the first aperture;
• and
• the ground terminal is exposed by the second aperture;
• a network comprising:
• a first network cover comprising a conductive layer extending laterally over the top side of the first encapsulant;
• a first interconnect contact comprising the conductive layer covering the first aperture sidewall and coupled to the first power terminal and the first network cover;
• a first network interconnect over the first interconnect contact in the first aperture, wherein the first interconnect contact is interposed between the first encapsulant and the first network interconnect;
• a second interconnect contact covering the second aperture sidewall and coupled to the ground terminal;
• a second network interconnect over the second interconnect contact in the second aperture, wherein the second interconnect contact is interposed between the first encapsulant and the second network interconnect;
• a second network cover comprising:
• a second cover ceiling over the first network cover;
• and
• second cover sidewalls extending from the second cover ceiling;
• and
• a network contact coupled to the second interconnect contact and extending laterally over the top side of the first encapsulant to an outer edge of the first encapsulant;
• and
• a second encapsulant over the first encapsulant covering the first interconnect contact, the second interconnect contact, the network contact, and the first network cover;
• wherein:
• the network contact is coupled to one of the second cover sidewalls at the outer edge of the first encapsulant.

A method of manufacturing an electronic device, comprising:

• providing a substrate having a substrate top side, a substrate bottom side opposite to the substrate top side, and a substrate conductive structure comprising:
• internal terminals adjacent to the substrate top side and comprising a first internal terminal and a second internal terminal;
• a grounded path coupled to the first internal terminal;
• and
• a powered path coupled to the second internal terminal;
• coupling a first electronic component to the substrate top side;
• providing a first encapsulant covering the first electronic component and the substrate top side and comprising a first encapsulant top side;
• providing a first aperture extending through the first encapsulant to expose the first internal terminal, the first aperture comprising a first aperture sidewall;
• providing a second aperture extending through the first encapsulant to expose the second internal terminal, the second aperture comprising a second aperture sidewall;
• providing a conductive layer over the first encapsulant top side, over the first aperture sidewall, over the first internal terminal, over the second aperture sidewall, and over the second internal terminal;
• patterning the conductive layer to provide:
• a first network cover over the first encapsulant top side;
• a first interconnect contact coupled to the first network cover and over the first aperture sidewall and over the first internal terminal;
• a second interconnect contact over the second aperture sidewall and the second internal terminal, wherein the second interconnect contact is electrically decoupled from the first interconnect contact and the first network cover;
• and
• a network contact extending laterally along the first encapsulant top side to an outer edge of the first encapsulant and coupled to the second interconnect contact;
• providing a first network interconnect in the first aperture over the first interconnect contact;
• providing a second network interconnect in the second aperture over the second interconnect contact;
• and
• providing a second network cover having a second cover ceiling and a second cover sidewall extending from the second cover ceiling, wherein the second cover sidewall is coupled to the network contact at the outer edge of the first encapsulant;
• wherein:
• the first network cover, the first interconnect contact, and the first network interconnect are part of the powered path;
• and
• the second network cover, the second interconnect contact, the network contact, and the second network interconnect are part of the grounded path.