System-in-package assembly, and packaging method and manufacturing method therefor

Abstract

Disclosed are a system-in-package (SIP) assembly, a packaging method and a manufacturing method thereof. An integrated outer surface of a plastic package of the SIP assembly includes at least two shielding layer regions, and a spacing region is provided between any two of the shielding layer regions. By providing the shielding layer on the integrated outer surface of the plastic package, the shield body can be prevented from becoming a medium for high-frequency and high-power noise to affect normal operation of surrounding devices. That is, the present disclosure prevents noise signals in shielded regions from interfering with each other, thus protecting a specific device and circuit.

Dependencies are inferred from the claim text.