Apparatus and method for selectively forming a shielding layer on a semiconductor package

An apparatus for selectively forming a shielding layer on a semiconductor package, comprising:

• a tray comprising a plurality of package seats each being configured to receive the semiconductor package, wherein the tray defines each of the plurality of package seats, one or more sets of guide holes outside the plurality of package seats;
• deposition masks, wherein each of the deposition masks comprises:
• a set of pins releasably inserted within one set of the one or more sets of guide holes to place the deposition mask on the tray;
• and
• a cover attached to the set of pins, wherein the cover is configured to cover at least a portion of an outer surface of the semiconductor package received within the plurality of package seats when the set of pins is inserted within the one or more sets of guide holes associated with the plurality of package seats;
• and
• a deposition source configured to deposit a shielding material onto the tray to form the shielding layer on the semiconductor packages when received in the plurality of package seats.