H10W 42/263
Shielding bumps
Official title: {Shielding bumps}
H10W42/263 (Shielding bumps) appears on 113 US grants and 135 published applications in this corpus.
Search patents in H10W- Granted patents
- 113
- Published applications
- 135
- Assignees
- 72
- Inventors
- 271
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 2 | 0 |
| 2001 | 4 | 1 |
| 2002 | 2 | 3 |
| 2003 | 5 | 4 |
| 2004 | 3 | 2 |
| 2005 | 2 | 2 |
| 2006 | 4 | 12 |
| 2007 | 2 | 10 |
| 2008 | 2 | 6 |
| 2009 | 5 | 0 |
| 2010 | 2 | 5 |
| 2011 | 12 | 8 |
| 2012 | 5 | 2 |
| 2013 | 1 | 3 |
| 2014 | 2 | 3 |
| 2015 | 4 | 3 |
| 2016 | 5 | 5 |
| 2017 | 5 | 2 |
| 2018 | 1 | 4 |
| 2019 | 5 | 3 |
| 2020 | 4 | 5 |
| 2021 | 5 | 5 |
| 2022 | 4 | 7 |
| 2023 | 2 | 11 |
| 2024 | 8 | 16 |
| 2025 | 6 | 4 |
| 2026 | 10 | 9 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Chip package with heat dissipation plate and manufacturing method thereof18 Aug 2026US 12,713,930 B2Stats Chippac Semiconductor (Jiangyin) Co., Ltd.
- Balun phase and amplitude imbalance correction4 Aug 2026US 12,700,843 B2Texas Instruments Incorporated
- Chip package with electromagnetic interference shielding layer and method of manufacturing the same12 May 2026US 12,628,654 B2Walton Advanced Engineering Inc.
- Method for manufacturing electronic component device and electronic component device12 May 2026US 12,628,660 B2
- Semiconductor package including antenna and method of manufacturing the semiconductor package28 Apr 2026US 12,614,850 B2Nepes Co., Ltd.
- High-frequency module and phased array antenna module3 Sep 2026US 2026/0262504 A1Fujikura Ltd.
- Dual sided molded package with varying interconnect pad sizes and varying exposed solderable area16 Jul 2026US 2026/0206648 A1Skyworks Solutions, Inc.
- Chip, chip manufacturing method, computing device, and signal transmission method28 May 2026US 2026/0150737 A1Huawei Technologies Co., Ltd.
- Electronic devices and methods of manufacturing electronic devices21 May 2026US 2026/0144077 A1Amkor Technology Singapore Holding Pte.Ltd.
- Dual-sided mold grid array with a copper post isolation wall and method of forming same7 May 2026US 2026/0129818 A1Skyworks Solutions, Inc.
Most cited
By later US patents
- Method and system for controlling radio frequency radiation in microelectronic packages using heat dissipation structures237US 6,282,095 B1Compaq Computer Corporation · 2001
- Multi-level electronic package and method for making same129US 6,618,267 B1International Business Machines Corporation · 2003
- Ball grid array (BGA) integrated circuit packages126US 5,796,170 ANorthern Telecom Limited · 1998
- Coaxial through chip connection98US 7,157,372 B1Cubic Wafer, Inc. · 2007
- High-frequency electronic package with arbitrarily-shaped interconnects and integral shielding96US 6,137,693 AAgilent Technologies, Inc. · 2000