High-frequency electronic package with arbitrarily-shaped interconnects and integral shielding

A surface mountable electronic package comprising:

• a first substrate, including an arbitrarily shaped solder structure in a predetermined configuration upon said first substrate;
• and
• a second substrate, including
• a pattern of solder-wettable material corresponding to the predetermined solder configuration on the first substrate, wherein said first and second substrates are alignably and fixably coupled so that the solder configuration of the first substrate is congruent with the wettable pattern on the second substrate so that an operable electronic package is formed and wherein the solder structure includes a gapless wall substantially around the periphery of the package, and wherein multiple surface mountable packages are operably connected to the second substrate which is larger than the first substrate;
• and,
• wherein multiple substrates are operably connected on top of each other forming a vertical stack resulting in a three-dimensional package.

An electronic package comprising:

• a first substrate, on which a pattern of solder walls is deposited;
• and
• a second substrate, including
• a pattern of solder-wettable material corresponding to the pattern of solder walls on the first substrate, wherein said first and second substrates are alignably and fixably coupled so that the pattern of solder walls of the first substrate is congruent with the wettable pattern on the second substrate so that an operable electronic package is formed;
• wherein the pattern of solder walls includes a gapless wall substantially around the periphery of the package;
• and,
• where the first substrate has electronic components including integrated circuit chips and passive components mounted on it to form an electronic subsystem.

An electronic package comprising:

• a first substrate, on which a pattern of solder walls is deposited;
• and
• a second substrate, including
• a pattern of solder-wettable material corresponding to the pattern of solder walls on the first substrate, wherein said first and second substrates are alignably and fixably coupled so that the pattern of solder walls of the first substrate is congruent with the wettable pattern on the second substrate so that an operable electronic package is formed;
• wherein the pattern of solder walls includes a gapless wall substantially around the periphery of the package;
• and,
• where both substrates have one or more full ground planes operable along with the gapless wall around the periphery, to substantially shield the package and its interconnects electromagnetically and environmentally.

An electronic package comprising:

• a first substrate, on which a pattern of solder walls is deposited;
• and
• a second substrate, including
• a pattern of solder-wettable material corresponding to the pattern of solder walls on the first substrate, wherein said first and second substrates are alignably and fixably coupled so that the pattern of solder walls of the first substrate is congruent with the wettable pattern on the second substrate so that an operable electronic package is formed;
• wherein the pattern of solder walls includes a gapless wall substantially around the periphery of the package;
• and,
• where the first substrate is a multi-layer printed circuit board or a ceramic substrate.

An electronic package comprising:

• a first substrate, on which a pattern of solder walls is deposited;
• and
• a second substrate, including
• a pattern of solder-wettable material corresponding to the pattern of solder walls on the first substrate, wherein said first and second substrates are alignably and fixably coupled so that the pattern of solder walls of the first substrate is congruent with the wettable pattern on the second substrate so that an operable electronic package is formed;
• wherein the pattern of solder walls includes a gapless wall substantially around the periphery of the package;
• and,
• where the edges of the first substrate are plated with electrically conductive metallization, which, with the gapless wall and continuous ground planes in the substrates, complete the electromagnetic shielding and environmental isolation.