Dual-sided mold grid array with a copper post isolation wall and method of forming same

Abstract

An electronic package for mounting to a circuit board is provided. The electronic package comprises a substrate, and first and second electronic modules. The substrate has opposed first and second sides. The first and second electronic modules are disposed on the second side of the substrate to be spaced apart from each other. Third and fourth electronic modules are disposed on the first side of the substrate and spaced apart from each other. The electronic package also comprises at least one wall section disposed between the first and second electronic modules. The at least one wall section is mounted on the second side of the substrate. The at least one wall section is configured to electromagnetically shield the first and second electronic modules from each other. Further provided are methods of forming the electronic package.

Dependencies are inferred from the claim text.