Method for manufacturing electronic component device and electronic component device
OwnerTomoaki Shibata, Naoya Suzukiinventors
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Abstract
A method for manufacturing an electronic component device including: preparing a wiring structure having a wiring portion including a metal wiring and an insulating layer and having two main surfaces opposite to each other, and a connection portion provided on one of the main surfaces of the wiring portion; fixing one or more conductor pins on the wiring substrate in a state in which the one or more conductor pins stand against the connection portion; mounting one or more electronic components on the wiring structure; and forming an encapsulation layer for encapsulating the electronic component and the conductor pin on the wiring structure.
Claims13
A method for manufacturing an electronic component device, comprising:
- preparing a wiring structure comprising a wiring portion comprising a metal wiring and an insulating layer, the wiring portion having two main surfaces opposite to each other, and a connection portion provided on a mounting surface selected from one of the two main surfaces of the wiring portion;
- fixing a plurality of conductor pins on the connection portion, wherein each of the plurality of conductor pins are formed as a metallic columnar-shaped body having a uniform width that is less than a length which extends perpendicular to the mounting surface of the wiring structure;
- mounting one or more electronic components on the wiring structure;
- and
- forming an encapsulation layer for encapsulating the one or more electronic components and the plurality of conductor pins on the wiring structure.
A method for manufacturing an electronic component device, comprising:
- preparing a wiring structure including a wiring portion comprising a metal wiring and an insulating layer, the wiring portion having two main surfaces opposite to each other, and a connection portion provided on a mounting surface selected from one of the two main surfaces of the wiring portion;
- mounting one or more electronic components on the mounting surface of the wiring structure;
- fixing a plurality of conductor pins on the connection portion;
- and
- forming an encapsulation layer for encapsulating the one or more electronic components and the plurality of conductor pins on the wiring structure,
- wherein a first set of the plurality of conductor pins are spaced apart from each other so as to form a first row of pins that surrounds the one or more electronic components,
- a second set of the plurality of conductor pins are spaced apart from each other so as to form a second row of pins that surrounds the one or more electronic components without crossing the first row of pins, and
- the second set of pins are offset from the first set of pins such that the plurality of conductor pins are arranged in a staggered arrangement around the one or more electronic components.
Dependencies are inferred from the claim text.