High-frequency module and phased array antenna module
AssigneeFujikura Ltd.
InventorMichikazu Tomita
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Abstract
The present invention relates to a high-frequency module including an IC package in which a plurality of solder bumps are arranged on a plane and a substrate which has a mounting surface for mounting the IC package, wherein an inner metal pattern which is not electrically grounded is formed on the mounting surface at a portion overlapping with the IC package in a plan view, wherein the plurality of solder bumps include an RF bump through which a high-frequency signal passes and a GND bump which is electrically grounded, and wherein the GND bump is disposed on a shortest line segment connecting the RF bump and the inner metal pattern in a plan view.
Claims11
A high-frequency module comprising:
- an IC package in which a plurality of solder bumps are arranged on a plane;
- and
- a substrate which has a mounting surface for mounting the IC package,
- wherein an inner metal pattern is formed on the substrate to be disposed at a portion overlapping with the IC package in a plan view,
- wherein the plurality of solder bumps include
- an RF bump through which a high-frequency signal passes, and
- a GND bump which is electrically grounded, and
- wherein the GND bump is disposed on a shortest line segment connecting the RF bump and the inner metal pattern in a plan view.
Dependencies are inferred from the claim text.