US 6,618,267 B1 · Multi-level electronic package and method for making same

Abstract

A multi-level package, and method for making same, that offers a small size with compartmentalized areas that allow for radiation shielding is disclosed. In its simplest embodiment, the invention comprises two cards and an interposer interposed between the two cards. The interposer preferably has an opening, and the combination of the interposer's opening and the two cards form a cavity. The cavity allows for a high amount of components to be packed into a small, three-dimensional space. The interposer supports can act like a Faraday shield. The two cards and interposer can be multi-layered and support any type of chip or package connection on each side of each card or interposer, including through-hole, surface mount, and direct-chip attachment connections. Finally, pick-up plates or heat sinks can be attached to the package.

Claims28

Dependent claims

A package for containing electronic components, the package comprising:

a first circuitized card;
a second circuitized card;
an interposer interposed between the first and second circuitized cards, the interposer having an opening the opening in the interposer and the first and second circuitized card forming a cavity for containing at least one electronic component wherein the first circuitized card has a bottom surface and there Is at least one component mounted to the bottom surface, wherein the interposer, first circuitized card, and second circuitized card are circuitized multi-layer organic laminate cards, wherein the first circuitized card and interposer electrically and physically connected through a ball grid array and the interposer and the second circuitized card are electrically and physically connected through a ball grid array.

A package for containing electronic components, the package comprising:

a first circuitized card having a top and bottom surface;
a second circuitized card having a top and bottom surface;
an interposer having an opening, a top surface, and a bottom surface, the interposer being electrically connected to the first circuitized card and the second circuitized card through a first and second set of connections, the first set of connections being interposed between the bottom surface of the first circuitized card and the top surface of the interposer, the second set of connections being interposed between the bottom surface of the interposer and the top surface of the second circuitized card, wherein (a) the bottom surface of the second circuitized card has a third set of connections for attaching the second circuitized card to a system card, (b) the opening in the interposer, the bottom surface of the first circuitized card, and the top surface of the second circuitized card form a cavity for containing at least one electronic component, (c) the Interposer, first circuitized card, and second circuitized card are circuitized multi-layer organic laminate cards, and (d) each set of connections of the first, second and third sets of connections is a ball grid array.

Dependencies are inferred from the claim text.

Multi-level electronic package and method for making same

Life of this patent

Multi-level electronic package and method for making same

Life of this patent

Abstract

Claims28