Semiconductor package including antenna and method of manufacturing the semiconductor package

A semiconductor package comprising:

• a lower package;
• and
• a first upper package stacked on the lower package,
• wherein the lower package includes:
• a first redistribution structure including a first redistribution insulating layer and a first conductive layer;
• a semiconductor chip mounted on the first redistribution structure;
• a first molding layer on the first redistribution structure and surrounding the semiconductor chip;
• and
• first vertical connection conductors disposed on the first redistribution structure and vertically passing through the first molding layer,
• wherein the first upper package includes:
• a second molding layer disposed on the lower package;
• second vertical connection conductors vertically passing through the second molding layer and electrically connected to the first vertical connection conductors;
• and
• a first antenna structure disposed on the second molding layer,
• wherein the first antenna structure includes:
• active antenna patterns disposed on an upper surface of the second molding layer and extending along the upper surface of the second molding layer;
• a lower cover insulating layer disposed on the upper surface of the second molding layer and covering the active antenna patterns;
• a dielectric layer disposed on the lower cover insulating layer and separated from the active antenna patterns;
• parasitic antenna patterns on the dielectric layer;
• and
• an upper cover insulating layer disposed on the dielectric layer and covering the parasitic antenna patterns,
• wherein an antenna ground conductive layer electrically grounded is disposed between the lower package and the second molding layer, a distance in a vertical direction between each of the active antenna patterns and the antenna ground conductive layer is between 100 micrometers and 600 micrometers, and a thickness of the second molding layer in the vertical direction is between 50 micrometers and 400 micrometers.