H10W 42/273
The arrangements being between laterally adjacent chips
Official title: {the arrangements being between laterally adjacent chips, e.g. walls between chips}
H10W42/273 (The arrangements being between laterally adjacent chips) appears on 397 US grants and 492 published applications in this corpus.
Search patents in H10W- Granted patents
- 397
- Published applications
- 492
- Assignees
- 107
- Inventors
- 831
- Latest grant
- 25 Aug 2026
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| Year | Granted patents | Published applications |
|---|---|---|
| 2003 | 1 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 1 |
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| 2008 | 0 | 0 |
| 2009 | 1 | 0 |
| 2010 | 1 | 1 |
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| 2012 | 2 | 4 |
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| 2014 | 2 | 9 |
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| 2016 | 7 | 7 |
| 2017 | 9 | 21 |
| 2018 | 23 | 50 |
| 2019 | 37 | 36 |
| 2020 | 43 | 70 |
| 2021 | 43 | 41 |
| 2022 | 37 | 61 |
| 2023 | 40 | 88 |
| 2024 | 48 | 41 |
| 2025 | 63 | 23 |
| 2026 | 23 | 20 |
By publication year. 2026 runs to 8 Oct.
Recent patents
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Most cited
By later US patents
- Encapsulation package and method of packaging an electronic circuit module314US 6,534,711 B1The Goodyear Tire & Rubber Company · 2003
- Semiconductor package122US 10,727,212 B2Samsung Electronics Co., Ltd. · 2020
- Overmolded semiconductor package with a wirebond cage for EMI shielding115US 8,071,431 B2Skyworks Solutions, Inc. · 2011
- Overmolded semiconductor package with a wirebond cage for EMI shielding87US 8,399,972 B2Skyworks Solutions, Inc. · 2013
- System and method for RF shielding of a semiconductor package58US 8,093,691 B1Amkor Technology, Inc. · 2012