System and method for RF shielding of a semiconductor package
AssigneeAmkor Technology, Inc.
InventorsRuben Fuentes, Christopher Scanlan, Jong Chun
Life of this patent
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Abstract
A semiconductor device has a substrate having a plurality of metal traces. At least one electronic component is electrically coupled to a first surface of the substrate. A mold compound is used for encapsulating portions of the electronic component and the first surface of the substrate, wherein a portion of the mold compound is removed around at least one side of the electronic component. A conductive coating is applied to the mold compound and an area where the portion of the mold compound is removed.
Claims18
A semiconductor device comprising:
- a substrate having a plurality of metal traces;
- a plurality of electronic components electrically coupled to a first surface of the substrate;
- a mold compound for encapsulating portions of the electronic components and the first surface of the substrate, wherein a portion of the mold compound is removed between the electronic components and forms at least one channel between the plurality of electronic components;
- and
- a conductive coating applied to an exterior top surface of the mold compound and an area where the portion of the mold compound is removed, wherein the conductive coating is applied to at least one side surface of the substrate and attached to a ground plane exposed on the side surface.
A semiconductor device comprising:
- a substrate having a plurality of metal traces;
- a plurality of electronic components electrically attached to a first surface of the substrate;
- ground wires attached to the first surface of the substrate and around a perimeter of the device;
- a mold compound for encapsulating portions of the semiconductor device and the first surface of the substrate, wherein a portion of the mold compound is removed between the electronic components and forms at least one channel between the plurality of electronic components, top surfaces of the ground wires are exposed through the mold compound;
- and
- a conductive coating applied to an exterior top surface of the mold compound and an area where the portion of the mold compound is removed, the conductive coating in contact with the exposed top surfaces of the ground wires.
A semiconductor device comprising:
- a substrate having a plurality of metal traces;
- a plurality of electronic components electrically coupled to a first surface of the substrate;
- a mold compound for encapsulating portions of the electronic component and the first surface of the substrate, wherein a portion of the mold compound is removed around at least one side of the electronic component;
- and
- means for providing RF shielding applied to a top surface of the mold compound and an area where the portion of the mold compound is removed, wherein the means for providing RF shielding is applied to at least one side surface of the substrate and attached to a ground plane exposed on the side surface.
Dependencies are inferred from the claim text.