Semiconductor package with top-lid surface-mounted technology capacitors for enhanced performance

A method for preparing a semiconductor package, comprising:

• disposing an interposer on a laminate;
• disposing a die atop the interposer, wherein the interposer comprises a plurality of vias configured for electrical connections between the die and the laminate;
• attaching a lid to the interposer via one or more legs of the lid in a configuration such that the attachment forms an encapsulation that encapsulates the die therewithin;
• and
• electrically connecting one or more capacitive or passive components to the laminate.

A wireless device comprising a semiconductor package, wherein the semiconductor package comprises:

• a die disposed on a laminate;
• an interposer disposed between the die and the laminate, the interposer comprising a plurality of vias configured for electrical connections between the die and the laminate;
• a lid attached to the interposer via one or more legs of the lid in a configuration such that the attachment forms an encapsulation that encapsulates the die therewithin;
• and
• one or more surface-mounted technology (SMT) decoupling capacitors, radio frequency (RF) tuning capacitors, and/or other passive components electrically connected to the laminate.