Semiconductor package

A semiconductor package comprising:

• a core member;
• a first through-hole passing through the core member;
• a second through-hole passing through the core member and spaced apart from the first through-hole;
• one or more passive components in the first through-hole;
• a semiconductor chip in the second through-hole, and having an active surface with a connection pad and an inactive surface opposing the active surface;
• an encapsulant covering at least a portion of each of the passive component and the inactive surface of the semiconductor chip, and filling at least a portion of each of the first through-hole and the second through-hole;
• and
• a connection structure on the passive component and the active surface of the semiconductor chip, and including at least one wiring layer electrically connected to the passive component and the connection pad of the semiconductor chip, and
• wherein a first bottom surface of the second through-hole has a step difference from a second bottom surface of the first through-hole.

A semiconductor package comprising:

• a core member having one or more first through-holes and at least one second through-hole;
• a first insulation layer below the one or more first through-holes;
• one or more passive components on the first insulation layer in the one or more first through-holes;
• a second insulation layer below the first insulation layer and below the second through-hole;
• a semiconductor chip on the second insulation layer in the at least one second through-hole.

A method of manufacturing a semiconductor package comprising:

• obtaining a core member with a first through-hole and a second through-hole;
• disposing one or more passive components in the first through-hole;
• forming a first insulation layer on the one or more passive components and on at least a portion of the core member;
• disposing a semiconductor chip in the second through-hole;
• and
• forming a second insulation layer on the semiconductor chip and on the first insulation layer.