H10W 42/265
Shielding wires
Official title: {Shielding wires, e.g. constant potential wires}
H10W42/265 (Shielding wires) appears on 69 US grants and 74 published applications in this corpus.
Search patents in H10W- Granted patents
- 69
- Published applications
- 74
- Assignees
- 51
- Inventors
- 167
- Latest grant
- 19 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 0 |
| 2002 | 2 | 1 |
| 2003 | 0 | 1 |
| 2004 | 0 | 1 |
| 2005 | 1 | 4 |
| 2006 | 3 | 0 |
| 2007 | 0 | 1 |
| 2008 | 0 | 2 |
| 2009 | 1 | 2 |
| 2010 | 0 | 3 |
| 2011 | 3 | 2 |
| 2012 | 3 | 1 |
| 2013 | 2 | 3 |
| 2014 | 4 | 2 |
| 2015 | 4 | 3 |
| 2016 | 4 | 2 |
| 2017 | 1 | 4 |
| 2018 | 6 | 4 |
| 2019 | 4 | 3 |
| 2020 | 3 | 7 |
| 2021 | 4 | 4 |
| 2022 | 6 | 7 |
| 2023 | 4 | 7 |
| 2024 | 5 | 3 |
| 2025 | 3 | 2 |
| 2026 | 2 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- High-frequency module and communication device19 May 2026US 12,633,956 B2Murata Manufacturing Co., Ltd.
- Semiconductor package and method of manufacturing the same27 Jan 2026US 12,538,805 B2Chipbond Technology Corporation
- Semiconductor device package7 Oct 2025US 12,438,128 B2Advanced Semiconductor Engineering, Inc.
- Electronic package and manufacturing method thereof12 Aug 2025US 12,388,062 B2Siliconware Precision Industries Co., Ltd.
- Wire bond wires for interference shielding18 Mar 2025US 12,255,153 B2Adeia Semiconductor Technologies LLC
- Package device6 Aug 2026US 2026/0231776 A1Innolux Corporation
- Integrated Electronic Component30 Jul 2026US 2026/0223708 A1NTT, Inc.
- Semiconductor device25 Jun 2026US 2026/0182386 A1Mitsubishi Electric Corporation
- Semiconductor package16 Apr 2026US 2026/0107777 A1Samsung Electronics Co., Ltd.
- Semiconductor package16 Apr 2026US 2026/0107803 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Semiconductor device46US 6,330,165 B1Hitachi, Ltd. · 2001
- High-frequency, high-density semiconductor chip package with screening bonding wires43US 5,606,196 ASamsung Electronics Co., Ltd. · 1997
- Wirebonded assemblage method and apparatus37US 7,088,009 B2Freescale Semiconductor, Inc. · 2006
- Bond wire arrangement for minimizing crosstalk30US 8,558,398 B1Avago Technologies General IP (Singapore) Pte. Ltd. · 2013
- Semiconductor package with reduced inductive coupling between adjacent bondwire arrays28US 8,030,763 B2Freescale Semiconductor, Inc. · 2011