Wirebonded assemblage method and apparatus
AssigneeFreescale Semiconductor, Inc.
InventorDeborah A. Hagen
Life of this patent
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Abstract
A system (10) is disclosed having a circuit portion (18,26,36) containing more than electrical conductors and a wirebonded assemblage (12,14,16) overlying the circuit portion (18,26,36). The wirebonded assemblage (12,14,16) comprises a plurality of wirebonded wires ((50,52),(60,64),(66,68)), each of the plurality of wirebonded wires being electrically coupled. The wirebonded assemblage (12,14,16) provides electrical shielding for the circuit portion (18,26,36). In one embodiment, the wirebonded assemblage provides for heat spreading.
Claims19
A system, comprising:
- a circuit portion, containing more than electrical conductors;
- and
- a wirebonded assemblage, overlying the circuit portion,
- wherein the wirebonded assemblage comprises a plurality of wirebonded wires,
- wherein each of the plurality of wirebonded wires are electrically coupled,
- wherein the wirebonded assemblage provides electrical shielding for the circuit portion, and
- wherein a first one of the plurality of wirebonded wires is neither parallel nor perpendicular to a second one of the plurality of wirebonded wires.
A method for forming a wirebonded assemblage, comprising:
- providing a circuit portion having at least one of an active component and a passive component;
- wirebonding a plurality of wirebonded wires overlying the least one of the active component and the passive component;
- electrically coupling the plurality of wirebonded wires;
- and
- electrically shielding the least one of the active component and the passive component using the plurality of wirebonded wires.
A system, comprising:
- a circuit portion, containing more than electrical conductors;
- a first plurality of wirebonded wires, overlying any two edges of the circuit portion;
- and
- a second plurality of wirebonded wires, overlying any two edges of the circuit portion;
- wherein the first plurality of wirebonded wires and the second plurality of wirebonded wires are electrically coupled, and
- wherein the first plurality of wirebonded wires and the second plurality of wirebonded wires are used to provide electrical shielding for the circuit portion, and
- wherein the first plurality of wirebonded wires is neither parallel nor perpendicular to the second plurality of wirebonded wires.
Dependencies are inferred from the claim text.