Semiconductor package and method of manufacturing the same
AssigneeChipbond Technology Corporation
InventorsShrane-Ning Jenq, Chen-Yu Wang, Chin-Tang Hsieh, Shu-Yeh Chang, Lung-Hua Ho
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Abstract
In a method of manufacturing a semiconductor package, at least one conductive wire is formed on a substrate in a wire bonding process, a ball end of the conductive wire is located above the substrate, a molding material is provided to cover the conductive wire except the ball end, and an EMI shielding layer is formed on the molding material to connect to the ball end. Owing to the ball end is exposed on the molding material, connection area of the EMI shielding layer to the conductive wire is increased to improve connection strength and reliability between the EMI shielding layer and the conductive wire.
Claims8
A semiconductor package comprising:
- a substrate including at least one ground pad;
- a semiconductor component mounted on and electrically connected to the substrate;
- at least one conductive wire formed on the substrate by a wire bonding process, the at least one conductive wire includes a wire body, a conduction end located on one side of the wire body and a ball end located on the other side of the wire body, an outer diameter of the ball end is greater than an outer diameter of the wire body, the wire body is extended upwardly from the substrate, the conduction end is bonded to the at least one ground pad, and the ball end is located above the substrate;
- a molding material provided on the substrate and configured to cover the semiconductor component, the wire body and the conduction end, wherein there is a notch on the molding material, the ball end is visible from the notch and has an exposed surface which is coplanar to an inner surface of the notch;
- and
- an EMI shielding layer formed on the molding material and connected to the ball end.
A method of manufacturing semiconductor package comprising the steps of:
- providing a carrier including a plurality of substrates connected with each other, each of the plurality of substrates includes at least one ground pad;
- providing a plurality of semiconductor components, each of the plurality semiconductor components is mounted on and electrically connected to one of the plurality of substrates;
- performing a wire bonding process, at least one conductive wire is formed on each of the plurality of substrates, the at least one conductive wire includes a wire body, a conduction end located on one side of the wire body and a ball end located on the other side of the wire body, an outer diameter of the ball end is greater than an outer diameter of the wire body, the wire body is extended upwardly from the substrate, the conduction end is configured to be bonded to the at least one ground pad of each of the plurality of substrates, and the ball end is configured to be located above each of the plurality of substrates;
- performing a molding process, a plurality of molding materials are provided on the carrier, each of the plurality of molding materials is configured to cover one of the plurality of semiconductor components, the wire body and the conduction end of the at least one conductive wire;
- performing a removing process to remove a part of each of the plurality of molding materials, wherein after the removing process, a notch is formed on each of the plurality of molding materials, the ball end is visible from the notch and has an exposed surface, the exposed surface is visible from an inner surface of the notch and is coplanar to the inner surface of the notch;
- and
- forming an EMI shielding layer on each of the plurality of molding materials, the EMI shielding layer is configured to be connected to the ball end of the at least one conductive wire.
Dependencies are inferred from the claim text.