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US 2026/0182386 A1Published application
Semiconductor device
AssigneeMitsubishi Electric Corporation
InventorsKazutake KADOWAKI, Hiroki SHIOTA
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Abstract
A semiconductor device includes: an insulating substrate; a pattern having a thin plate shape and made of metal, the pattern being formed on an upper surface of the insulating substrate; and a semiconductor chip joined to an upper surface of the pattern. A metal wire connected to the pattern at a plurality of connection points is provided above the pattern along an outer periphery of the pattern.
Claims21
A semiconductor device comprising:
- an insulating substrate;
- a pattern having a thin plate shape and made of metal, the pattern being formed on an upper surface of the insulating substrate;
- a semiconductor chip joined to an upper surface of the pattern;
- and
- a metal wire connected to the pattern at a plurality of connection points is provided above the pattern along an outer periphery of the pattern, wherein
- between the connection points adjacent to each other, the wire curves so as to protrude outward from an area above the pattern toward an end side of the insulating substrate.
3 more elements
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-11. (canceled)
Dependencies are inferred from the claim text.