High-frequency module and communication device

A high-frequency module capable of performing two-uplink for simultaneously transmitting a signal in a first transmission band included in a first frequency band and a signal in a second transmission band included in a second frequency band different from the first frequency band, the high-frequency module comprising:

• a module substrate having a first principal surface and a second principal surface facing each other;
• a first ground metal member arranged on the first principal surface;
• a first power amplifier, a second power amplifier, a first transmission filter, a second transmission filter, a first inductor, and a second inductor are arranged on the first principal surface;
• and
• a first switch and a second switch are arranged on the second principal surface, wherein
• the first switch is configured to switch connection and disconnection between the first power amplifier and the first transmission filter,
• the second switch is configured to switch connection and disconnection between the second power amplifier and the second transmission filter,
• the first transmission filter is connected to the first power amplifier and includes the first transmission band in a pass band,
• the second transmission filter is connected to the second power amplifier and includes the second transmission band in a pass band,
• in a plan view, the first ground metal member is arranged on the first principal surface between a first transmission component and a second transmission component,
• in a plan view, a second ground metal member is arranged on the second principal component between the first switch and the second switch.