Electronic package and manufacturing method thereof
AssigneeSiliconware Precision Industries Co., Ltd.
InventorsWen-Jung Tsai, Chih-Hsien Chiu, Chin-Chiang He, Ko-Wei Chang, Chien-Cheng Lin
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Abstract
An electronic package is provided and includes at least one electronic element, at least one first conductive structure and a second conductive structure disposed on one side of a carrier structure with at least one circuit layer, and an encapsulation layer covering the electronic element, the first conductive structure and the second conductive structure, where the first conductive structure is exposed from the encapsulation layer to externally connect required elements according to functional requirements.
Claims20
An electronic package, comprising:
- a carrier structure having at least one circuit layer and being defined with a first side and a second side opposing the first side;
- at least one second electronic element disposed on the second side of the carrier structure and electrically connected to the circuit layer;
- at least one first conductive structure disposed on the second side of the carrier structure and electrically connected to the circuit layer;
- an encapsulation layer formed on the second side of the carrier structure to cover the second electronic element and the first conductive structure, the encapsulation layer being defined with a first encapsulation portion and a second encapsulation portion that are integrally formed, wherein the second electronic element is located in the first encapsulation portion, and the first conductive structure is located in the second encapsulation portion, wherein a height of the first encapsulation portion is greater than a height of the second encapsulation portion, and the first conductive structure is exposed from the second encapsulation portion;
- and
- a second conductive structure disposed on the second side of the carrier structure and between the first encapsulation portion and the second encapsulation portion, electrically connected to the circuit layer, and having a composition different from a composition of the first conductive structure.
A method of manufacturing an electronic package, comprising:
- providing a carrier structure having at least one circuit layer, the carrier structure being defined with a first side and a second side opposing the first side;
- disposing at least one second electronic element and at least one first conductive structure on the second side of the carrier structure, wherein the second electronic element and the first conductive structure are electrically connected to the circuit layer;
- forming an encapsulation layer on the second side of the carrier structure to cover the second electronic element and the first conductive structure, the encapsulation layer being defined with a first encapsulation portion and a second encapsulation portion that are integrally formed, wherein a height of the first encapsulation portion is greater than a height of the second encapsulation portion, wherein the second electronic element is located in the first encapsulation portion, and the first conductive structure is located in the second encapsulation portion and exposed from the second encapsulation portion;
- and
- forming a second conductive structure on the second side of the carrier structure and between the first encapsulation portion and the second encapsulation portion, wherein the second conductive structure is electrically connected to the circuit layer, and has a composition different from a composition of the first conductive structure.
Dependencies are inferred from the claim text.