High-frequency, high-density semiconductor chip package with screening bonding wires

Abstract

A semiconductor device package including a semiconductor chip formed with a plurality of bonding pads including at least two multiple-bonding pads to which identical signals are transmitted; a substrate provided with a chip-support and a plurality of conductors for electrically connecting the chip to external devices; a plurality of bonding wires for electrically connecting said bonding pads to the conductors including multiple-bonding wires for electrically connecting the multiple-bonding pads to corresponding conductors; and a current looper for screening magnetic fields generated from the bonding wires so that the magnetic fields cannot interfere each other, the current looper being located between the multiple-bonding wires and bonded to the substrate at both ends.

Dependencies are inferred from the claim text.