H10W 42/271
The arrangements being between stacked chips
Official title: {the arrangements being between stacked chips}
H10W42/271 (The arrangements being between stacked chips) appears on 332 US grants and 429 published applications in this corpus.
Search patents in H10W- Granted patents
- 332
- Published applications
- 429
- Assignees
- 109
- Inventors
- 804
- Latest grant
- 9 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2008 | 0 | 1 |
| 2009 | 1 | 2 |
| 2010 | 1 | 1 |
| 2011 | 2 | 6 |
| 2012 | 3 | 18 |
| 2013 | 8 | 11 |
| 2014 | 13 | 21 |
| 2015 | 18 | 37 |
| 2016 | 31 | 18 |
| 2017 | 28 | 35 |
| 2018 | 26 | 28 |
| 2019 | 31 | 37 |
| 2020 | 28 | 37 |
| 2021 | 32 | 37 |
| 2022 | 22 | 38 |
| 2023 | 29 | 30 |
| 2024 | 28 | 22 |
| 2025 | 25 | 23 |
| 2026 | 6 | 27 |
By publication year. 2026 runs to 8 Oct.
Recent patents
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- Semiconductor device and manufacturing method thereof28 Apr 2026US 12,616,035 B2Kioxia Corporation
- Camera module3 Feb 2026US 12,542,957 B2Samsung Electro-Mechanics Co., Ltd.
- Photodetector17 Sep 2026US 2026/0282587 A1Sony Semiconductor Solutions Corporation
- Semiconductor package, semiconductor module, semiconductor device, and semiconductor package manufacturing method20 Aug 2026US 2026/0247982 A1Sony Semiconductor Solutions Corporation
- Semiconductor device and manufacturing method thereof20 Aug 2026US 2026/0247988 A1Kioxia Corporation
- Semiconductor package structure13 Aug 2026US 2026/0239985 A1Mediatek Inc.
- Semiconductor package6 Aug 2026US 2026/0231775 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Semiconductor device, structure and methods102US 9,640,531 B1Monolithic 3D Inc. · 2017
- Multi-chip semiconductor package with via components and method for manufacturing the same101US 9,607,967 B1Inotera Memories, Inc. · 2017
- Method of making a wafer level integration package60US 7,553,752 B2STATS ChipPAC, Ltd. · 2009
- Semiconductor device and method of forming ultra thin multi-die face-to-face WLCSP60US 9,735,113 B2STATS ChipPAC Pte. Ltd. · 2017
- Integrated voltage regulator and passive components44US 11,515,291 B2Adeia Semiconductor Inc. · 2022