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US 11,515,291 B2Granted
Integrated voltage regulator and passive components
AssigneeAdeia Semiconductor Inc.
InventorsJavier A. Delacruz, Don Draper, Belgacem Haba, Ilyas Mohammed
Life of this patent
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Abstract
It is highly desirable in electronic systems to conserve space on printed circuit boards (PCB). This disclosure describes voltage regulation in electronic systems, and more specifically to integrating voltage regulators and associated passive components into semiconductor packages with at least a portion of the circuits whose voltage(s) they are regulating.
Claims18
A semiconductor package, comprising:
- (A) a package substrate comprising:
- (i) a first side, and
- (ii) a second side opposite the first side;
- (B) a first semiconductor die comprising:
- (i) a first side coupled to the second side of the package substrate, and
- (ii) a second side opposite the first side and comprising a first bonding layer;
- (C) a second semiconductor die comprising:
- (i) a first side comprising a second bonding layer coupled to the second side of the first semiconductor die, and
- (ii) a second side opposite the first side;
- (D) a voltage regulator circuit comprising at least one active component;
- and
- (E) a first passive component electrically coupled to the voltage regulator circuit, the first passive component selected from a group consisting of:
- a capacitor, an inductor, a resistor, a fuse, and an antifuse, the first passive component comprising:
- (i) a first portion integrated into the first semiconductor die, and
- (ii) a second portion integrated into the second semiconductor die, wherein:
- the first portion and the second portion are coupled together to complete the first passive component when the second side of the first semiconductor die is coupled to the first side of the second semiconductor die.
13 more elements
A semiconductor package, comprising:
- (A) a package substrate comprising:
- (i) a first side, and
- (ii) a second side opposite the first side;
- (B) a first semiconductor die comprising:
- (i) a first side coupled to the second side of the package substrate, and
- (ii) a second side opposite the first side and comprising a first bonding layer;
- (C) a second semiconductor die comprising:
- (i) a first side comprising a second bonding layer coupled to the second side of the first semiconductor die, and
- (ii) a second side opposite the first side;
- (D) a voltage regulator circuit comprising at least one active component;
- (E) a first passive component electrically coupled to the voltage regulator circuit, the first passive component comprising:
- (i) a first portion integrated into the first semiconductor die, and
- (ii) a second portion integrated into the second semiconductor die, wherein:
- the first portion and the second portion are coupled together to complete the first passive component when the second side of the first semiconductor die is coupled to the first side of the second semiconductor die;
- and
- (F) a second passive component located between the first passive component and the first side of the first semiconductor die, wherein a component type of the second passive component is selected from a group consisting of:
- a capacitor, an inductor, and a resistor.
14 more elements
A semiconductor package, comprising:
- (A) a package substrate comprising:
- (i) a first side, and
- (ii) a second side opposite the first side;
- (B) a first semiconductor die comprising:
- (i) a first side coupled to the second side of the package substrate, and
- (ii) a second side opposite the first side and comprising a first bonding layer;
- (C) a second semiconductor die comprising:
- (i) a first side comprising a second bonding layer coupled to the second side of the first semiconductor die, and
- (ii) a second side opposite the first side;
- (D) a voltage regulator circuit comprising at least one active component;
- (E) a first passive component electrically coupled to the voltage regulator circuit, the first passive component comprising:
- (i) a first portion integrated into the first semiconductor die, and
- (ii) a second portion integrated into the second semiconductor die, wherein:
- the first portion and the second portion are coupled together to complete the first passive component when the second side of the first semiconductor die is coupled to the first side of the second semiconductor die;
- and
- (F) a second passive component located between the first passive component and the second side of the second semiconductor die, wherein a component type of the second passive component is selected from a group consisting of:
- a capacitor, an inductor, and a resistor.
14 more elements
Dependencies are inferred from the claim text.